PUMD9 vs PUMD9,165 feature comparison

PUMD9 Nexperia

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PUMD9,165 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Package Description PLASTIC, SC-88, 6 PIN PLASTIC, SC-88, 6 PIN
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
Date Of Intro 1999-01-08
Samacsys Manufacturer Nexperia
Additional Feature BUILT-IN BIAS RESISTOR RATIO IS 4.7 BUILT-IN BIAS RESISTOR RATIO IS 4.7
Collector Current-Max (IC) 0.1 A 0.1 A
Collector-Base Capacitance-Max 2.5 pF
Collector-Emitter Voltage-Max 50 V 50 V
Configuration SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR
DC Current Gain-Min (hFE) 100 100
JESD-30 Code R-PDSO-G6 R-PDSO-G6
JESD-609 Code e3 e3
Moisture Sensitivity Level 1 1
Number of Elements 2 2
Number of Terminals 6 6
Operating Temperature-Max 150 °C 150 °C
Operating Temperature-Min -65 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 260
Polarity/Channel Type NPN AND PNP NPN AND PNP
Power Dissipation-Max (Abs) 0.3 W
Reference Standard AEC-Q101; IEC-60134
Surface Mount YES YES
Terminal Finish TIN TIN
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 230 MHz
VCEsat-Max 0.1 V
Base Number Matches 15 1
Part Package Code TSSOP
Pin Count 6
Manufacturer Package Code SOT363
HTS Code 8541.21.00.95
Qualification Status Not Qualified

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Compare PUMD9,165 with alternatives