S29GL064A11BAIW13 vs S29GL064N11FAIV23 feature comparison

S29GL064A11BAIW13 Spansion

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S29GL064N11FAIV23 Cypress Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SPANSION INC CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA
Package Description FBGA-64 13 X 11 MM, FBGA-64
Pin Count 64
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 110 ns 110 ns
Boot Block TOP
JESD-30 Code R-PBGA-B64 R-PBGA-B64
JESD-609 Code e0 e0
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 4MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Type NOR TYPE NOR TYPE
Base Number Matches 1 1
Alternate Memory Width 8
Command User Interface YES
Common Flash Interface YES
Data Polling YES
Length 13 mm
Moisture Sensitivity Level 3
Number of Sectors/Size 128
Package Equivalence Code BGA64,8X8,40
Page Size 8/16 words
Peak Reflow Temperature (Cel) 260
Ready/Busy YES
Seated Height-Max 1.4 mm
Sector Size 64K
Standby Current-Max 0.000005 A
Supply Current-Max 0.05 mA
Terminal Pitch 1 mm
Toggle Bit YES
Width 11 mm

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