SC16C554DBIA68,518 vs XR16V554IV80-F feature comparison

SC16C554DBIA68,518 NXP Semiconductors

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XR16V554IV80-F Exar Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS EXAR CORP
Part Package Code LCC QFP
Package Description QCCJ, LDCC68,1.0SQ 12 X 12 MM, 1.40 MM HEIGHT, GREEN, PLASTIC, LQFP-80
Pin Count 68 80
Manufacturer Package Code SOT188-2
Reach Compliance Code compliant compliant
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Additional Feature ALSO OPERATES AT 2.5V AND 5V SUPPLY
Address Bus Width 5 3
Boundary Scan NO NO
Clock Frequency-Max 80 MHz 64 MHz
Communication Protocol ASYNC, BIT MIL STD 1553A; MIL STD 1553B; MIL STD 1760; MCAIR; STANAG-3838
Data Transfer Rate-Max 0.625 MBps 0.5 MBps
External Data Bus Width 8 8
JESD-30 Code S-PQCC-J68 S-PQFP-G80
JESD-609 Code e3 e3
Length 24.23 mm 12 mm
Low Power Mode NO NO
Moisture Sensitivity Level 3 3
Number of Serial I/Os 4 4
Number of Terminals 68 80
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ LFQFP
Package Equivalence Code LDCC68,1.0SQ QFP80,.55SQ,20
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 1.6 mm
Supply Voltage-Max 3.63 V 3.63 V
Supply Voltage-Min 2.97 V 2.97 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN MATTE TIN
Terminal Form J BEND GULL WING
Terminal Pitch 1.27 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 24.23 mm 12 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 1 1
Pbfree Code Yes

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