SC16C852SVIET,115
vs
935286451151
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
BGA
Package Description
TFBGA, BGA36,6X6,20
TFBGA,
Pin Count
36
Manufacturer Package Code
SOT912-1
Reach Compliance Code
compliant
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
4 Weeks
Samacsys Manufacturer
NXP
Address Bus Width
8
8
Boundary Scan
NO
NO
Clock Frequency-Max
80 MHz
80 MHz
Communication Protocol
ASYNC, BIT
ASYNC, BIT
Data Encoding/Decoding Method
NRZ
NRZ
Data Transfer Rate-Max
0.0000012122176018 MBps
0.0000012122176018 MBps
External Data Bus Width
8
8
JESD-30 Code
S-PBGA-B36
S-PBGA-B36
JESD-609 Code
e1
e1
Length
3.5 mm
3.5 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
1
Number of Serial I/Os
2
2
Number of Terminals
36
36
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Equivalence Code
BGA36,6X6,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Seated Height-Max
1.15 mm
1.15 mm
Supply Voltage-Max
1.95 V
1.95 V
Supply Voltage-Min
1.65 V
1.65 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
3.5 mm
3.5 mm
uPs/uCs/Peripheral ICs Type
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches
1
1
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