SC16C852SVIET,115 vs 935286451151 feature comparison

SC16C852SVIET,115 NXP Semiconductors

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935286451151 NXP Semiconductors

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code BGA
Package Description TFBGA, BGA36,6X6,20 TFBGA,
Pin Count 36
Manufacturer Package Code SOT912-1
Reach Compliance Code compliant unknown
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Address Bus Width 8 8
Boundary Scan NO NO
Clock Frequency-Max 80 MHz 80 MHz
Communication Protocol ASYNC, BIT ASYNC, BIT
Data Encoding/Decoding Method NRZ NRZ
Data Transfer Rate-Max 0.0000012122176018 MBps 0.0000012122176018 MBps
External Data Bus Width 8 8
JESD-30 Code S-PBGA-B36 S-PBGA-B36
JESD-609 Code e1 e1
Length 3.5 mm 3.5 mm
Low Power Mode YES YES
Moisture Sensitivity Level 1
Number of Serial I/Os 2 2
Number of Terminals 36 36
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Equivalence Code BGA36,6X6,20
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.15 mm 1.15 mm
Supply Voltage-Max 1.95 V 1.95 V
Supply Voltage-Min 1.65 V 1.65 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 3.5 mm 3.5 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 1 1

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