Part Details for SC16C852SVIET,115 by NXP Semiconductors
Overview of SC16C852SVIET,115 by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (2 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for SC16C852SVIET,115
Part # | Distributor | Description | Stock | Price | Buy | |
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Rochester Electronics | SC16C852SVIET - 1.8 V dual UART, 20 Mbit/s (max.) with 128-byte FIFOs, infrared (IrDA), and XScale VLIO bus interface RoHS: Compliant pbFree: No Status: Obsolete Min Qty: 1 | 1000 |
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$3.2200 / $3.7900 | Buy Now |
Part Details for SC16C852SVIET,115
SC16C852SVIET,115 CAD Models
SC16C852SVIET,115 Part Data Attributes:
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SC16C852SVIET,115
NXP Semiconductors
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Datasheet
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Compare Parts:
SC16C852SVIET,115
NXP Semiconductors
SC16C852SV - 1.8 V dual UART, 20 Mbit/s (max.) with 128-byte FIFOs, infrared (IrDA), and XScale VLIO bus interface BGA 36-Pin
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | BGA | |
Package Description | TFBGA, BGA36,6X6,20 | |
Pin Count | 36 | |
Manufacturer Package Code | SOT912-1 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | NXP | |
Address Bus Width | 8 | |
Boundary Scan | NO | |
Clock Frequency-Max | 80 MHz | |
Communication Protocol | ASYNC, BIT | |
Data Encoding/Decoding Method | NRZ | |
Data Transfer Rate-Max | 0.0000012122176018 MBps | |
External Data Bus Width | 8 | |
JESD-30 Code | S-PBGA-B36 | |
JESD-609 Code | e1 | |
Length | 3.5 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 1 | |
Number of Serial I/Os | 2 | |
Number of Terminals | 36 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA36,6X6,20 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.15 mm | |
Supply Voltage-Max | 1.95 V | |
Supply Voltage-Min | 1.65 V | |
Supply Voltage-Nom | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 3.5 mm | |
uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
Alternate Parts for SC16C852SVIET,115
This table gives cross-reference parts and alternative options found for SC16C852SVIET,115. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of SC16C852SVIET,115, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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SC16C852SVIET | IC 2 CHANNEL(S), 5M bps, SERIAL COMM CONTROLLER, PBGA36, 3.50 X 3.50 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SOT-912-1, TFBGA-36, Serial IO/Communication Controller | NXP Semiconductors | SC16C852SVIET,115 vs SC16C852SVIET |
935286451151 | 2 CHANNEL(S), 5Mbps, SERIAL COMM CONTROLLER, PBGA36, 3.50 X 3.50 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SOT-912-1, TFBGA-36 | NXP Semiconductors | SC16C852SVIET,115 vs 935286451151 |