SI4460-B1B-FMR
vs
3D3523D-5
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
SILICON LABORATORIES INC
|
DATA DELAY DEVICES INC
|
| Package Description |
QFN-20
|
SOP,
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Silicon Labs
|
|
| JESD-30 Code |
S-XQCC-N20
|
R-PDSO-G14
|
| Length |
4 mm
|
8.695 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
14
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
SOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Seated Height-Max |
0.9 mm
|
1.82 mm
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
MANCHESTER ENCODER/DECODER
|
MANCHESTER ENCODER/DECODER
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
NOT SPECIFIED
|
| Width |
4 mm
|
3.9 mm
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
14
|
| Qualification Status |
|
Not Qualified
|
| Technology |
|
CMOS
|
|
|
|
Compare SI4460-B1B-FMR with alternatives
Compare 3D3523D-5 with alternatives