ST16C554DIJ68
vs
SC16C554BIB64
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
EXAR CORP
|
PHILIPS SEMICONDUCTORS
|
| Package Description |
PLASTIC, LCC-68
|
QFP, QFP64,.47SQ,20
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
ALSO OPERATES AT 3.3V SUPPLY
|
|
| Address Bus Width |
3
|
|
| Boundary Scan |
NO
|
|
| Clock Frequency-Max |
24 MHz
|
|
| Communication Protocol |
ASYNC, BIT
|
|
| Data Encoding/Decoding Method |
NRZ
|
|
| Data Transfer Rate-Max |
0.1875 MBps
|
|
| External Data Bus Width |
8
|
|
| JESD-30 Code |
S-PQCC-J68
|
S-PQFP-G64
|
| JESD-609 Code |
e0
|
|
| Length |
24.23 mm
|
|
| Low Power Mode |
NO
|
|
| Number of DMA Channels |
1
|
|
| Number of I/O Lines |
|
|
| Number of Serial I/Os |
4
|
|
| Number of Terminals |
68
|
64
|
| On Chip Data RAM Width |
|
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QFP
|
| Package Equivalence Code |
LDCC68,1.0SQ
|
QFP64,.47SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
0
|
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Current-Max |
5 mA
|
|
| Supply Voltage-Max |
5.5 V
|
|
| Supply Voltage-Min |
4.5 V
|
|
| Supply Voltage-Nom |
5 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
24.23 mm
|
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
| Base Number Matches |
2
|
2
|
| HTS Code |
|
8542.31.00.01
|
|
|
|
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