TC4516BP vs HEF4516BDB feature comparison

TC4516BP Toshiba America Electronic Components

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HEF4516BDB NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code DIP
Package Description DIP, DIP,
Pin Count 16
Reach Compliance Code unknown unknown
Additional Feature TCO OUTPUT TCO OUTPUT
Count Direction BIDIRECTIONAL BIDIRECTIONAL
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDIP-T16 R-GDIP-T16
JESD-609 Code e0
Length 19.25 mm
Load Capacitance (CL) 50 pF 50 pF
Load/Preset Input YES YES
Logic IC Type BINARY COUNTER BINARY COUNTER
Mode of Operation SYNCHRONOUS SYNCHRONOUS
Number of Bits 4 4
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 400 ns 290 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.45 mm 5.08 mm
Supply Voltage-Max (Vsup) 18 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm 7.62 mm
fmax-Min 2 MHz 3 MHz
Base Number Matches 1 1
HTS Code 8542.39.00.01

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