TIBPAL20L10-20CNT vs GAL22V10-30LJM feature comparison

TIBPAL20L10-20CNT Texas Instruments

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GAL22V10-30LJM National Semiconductor Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC NATIONAL SEMICONDUCTOR CORP
Package Description DIP, DIP24,.3 DIP, DIP24,.3
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Architecture PAL-TYPE PAL-TYPE
JESD-30 Code R-PDIP-T24 R-GDIP-T24
Number of Dedicated Inputs 12 11
Number of I/O Lines 8 10
Number of Inputs 20 22
Number of Outputs 10 10
Number of Product Terms 40 132
Number of Terminals 24 24
Operating Temperature-Max 75 °C 125 °C
Operating Temperature-Min -55 °C
Organization 12 DEDICATED INPUTS, 8 I/O 11 DEDICATED INPUTS, 10 I/O
Output Function COMBINATORIAL MACROCELL
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP24,.3 DIP24,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programmable Logic Type OT PLD EE PLD
Propagation Delay 20 ns 30 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology TTL CMOS
Temperature Grade COMMERCIAL EXTENDED MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Number Matches 1 1
ECCN Code 3A001.A.2.C
Clock Frequency-Max 22.2 MHz
JESD-609 Code e0
Seated Height-Max 5.715 mm
Terminal Finish TIN LEAD
Width 7.62 mm

Compare TIBPAL20L10-20CNT with alternatives

Compare GAL22V10-30LJM with alternatives