TLV809EA26DPWR
vs
R3116K261C-TR-Y
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
RICOH ELECTRONIC DEVICES CO LTD
|
| Package Description |
HVSON, SOLCC5,.03,18
|
,
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Date Of Intro |
2020-06-23
|
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Adjustable Threshold |
NO
|
YES
|
| Analog IC - Other Type |
VOLTAGE DETECTOR
|
VOLTAGE SUPERVISOR/RESET IC
|
| JESD-30 Code |
S-PDSO-N5
|
S-PDSO-N4
|
| JESD-609 Code |
e4
|
e4
|
| Length |
2.92 mm
|
1 mm
|
| Moisture Sensitivity Level |
2
|
1
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
5
|
4
|
| Operating Temperature-Max |
125 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-50 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
HVQCCN
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1.12 mm
|
0.6 mm
|
| Supply Current-Max (Isup) |
0.0012 mA
|
0.0017 mA
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
1.7 V
|
0.6 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
GOLD
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.95 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Threshold Voltage-Nom |
+2.64V
|
+2.6V
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
10
|
| Width |
1.3 mm
|
1 mm
|
| Base Number Matches |
2
|
1
|
| Package Equivalence Code |
|
SOLCC4,.04,25
|
| Technology |
|
CMOS
|
|
|
|
Compare TLV809EA26DPWR with alternatives
Compare R3116K261C-TR-Y with alternatives