USB5826C-I/KD
vs
USB5533B-5000JZX
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
VQFN-100
|
9 X 9 MM, ROHS COMPLIANT, QFN-64
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Factory Lead Time |
7 Weeks
|
|
| Date Of Intro |
2019-07-25
|
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| Bus Compatibility |
I2C; SMBUS; SPI; UART
|
I2C; SMBUS; SPI; USB
|
| Clock Frequency-Max |
25 MHz
|
25 MHz
|
| Data Transfer Rate-Max |
625 MBps
|
625 MBps
|
| JESD-30 Code |
S-XQCC-N100
|
S-PQCC-N64
|
| Length |
12 mm
|
9 mm
|
| Number of Terminals |
100
|
64
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC100,.47SQ,16
|
LCC64,.35SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Seated Height-Max |
0.9 mm
|
1 mm
|
| Supply Voltage-Max |
1.32 V
|
1.31 V
|
| Supply Voltage-Min |
1.08 V
|
1.22 V
|
| Supply Voltage-Nom |
1.2 V
|
1.25 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
12 mm
|
9 mm
|
| uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
| Base Number Matches |
1
|
2
|
| Additional Feature |
|
ALSO OPERATES AT 3.3 V SUPPLY
|
| JESD-609 Code |
|
e3
|
| Screening Level |
|
TS 16949
|
| Supply Current-Max |
|
1029 mA
|
| Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare USB5826C-I/KD with alternatives
Compare USB5533B-5000JZX with alternatives