VSC7420XJQ-04
vs
VSC8489YJU-14
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Package Description |
HTFQFP, TQFP302,1SQ
|
CGA,
|
| Reach Compliance Code |
compliant
|
compliant
|
| Date Of Intro |
2019-10-10
|
|
| Samacsys Manufacturer |
Microchip
|
|
| JESD-30 Code |
S-PQFP-G302
|
S-PBGA-X196
|
| Length |
24 mm
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
302
|
196
|
| Operating Temperature-Max |
125 °C
|
110 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HTFQFP
|
CGA
|
| Package Equivalence Code |
TQFP302,1SQ
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
GRID ARRAY
|
| Seated Height-Max |
1.2 mm
|
|
| Supply Current-Max |
2 mA
|
|
| Supply Voltage-Nom |
1 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ETHERNET SWITCH
|
SUPPORT CIRCUIT
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
UNSPECIFIED
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Width |
24 mm
|
|
| Base Number Matches |
1
|
1
|
| HTS Code |
|
8542.39.00.01
|
|
|
|
Compare VSC7420XJQ-04 with alternatives
Compare VSC8489YJU-14 with alternatives