X2864AP-25 vs DM28C65-250/B feature comparison

X2864AP-25 Xicor Inc

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DM28C65-250/B LSI Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XICOR INC SEEQ TECHNOLOGY INC
Package Description PLASTIC, DIP-28 DIP, DIP28,.6
Reach Compliance Code unknown unknown
Access Time-Max 250 ns 250 ns
Additional Feature 16 BYTE PAGE WRITE; OVER 100 YEARS DATA RETENTION AUTOMATIC WRITE;PAGE WRITE
Command User Interface NO NO
Data Polling YES YES
Data Retention Time-Min 100
JESD-30 Code R-PDIP-T28 R-GDIP-T28
JESD-609 Code e0 e0
Length 36.32 mm
Memory Density 65536 bit 65536 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 8KX8 8KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP28,.6 DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Page Size 16 words 64 words
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.82 mm
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology NMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Toggle Bit NO NO
Width 15.24 mm
Write Cycle Time-Max (tWC) 10 ms
Base Number Matches 1 1
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.51
Ready/Busy YES
Screening Level 38535Q/M;38534H;883B
Standby Current-Max 0.00025 A
Supply Current-Max 0.06 mA

Compare X2864AP-25 with alternatives

Compare DM28C65-250/B with alternatives