XC2V6000-6FFG1152I vs XC2V6000-6FFG1152C feature comparison

XC2V6000-6FFG1152I AMD Xilinx

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XC2V6000-6FFG1152C AMD Xilinx

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152 35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152
Pin Count 1152 1152
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 820 MHz 820 MHz
Combinatorial Delay of a CLB-Max 0.35 ns 0.35 ns
JESD-30 Code S-PBGA-B1152 S-PBGA-B1152
JESD-609 Code e1 e1
Length 35 mm 35 mm
Moisture Sensitivity Level 4 4
Number of CLBs 8448 8448
Number of Equivalent Gates 6000000 6000000
Number of Terminals 1152 1152
Organization 8448 CLBS, 6000000 GATES 8448 CLBS, 6000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.4 mm 3.4 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 35 mm
Base Number Matches 1 1
ECCN Code 3A001.A.7.A
Number of Inputs 824
Number of Logic Cells 76032
Number of Outputs 824
Operating Temperature-Max 85 °C
Operating Temperature-Min
Package Equivalence Code BGA1152,34X34,40
Temperature Grade OTHER

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