XC2V6000-6FFG1152I
vs
XC3S2000-5VQ100C
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
Part Package Code |
BGA
|
QFP
|
Package Description |
35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152
|
VQFP-100
|
Pin Count |
1152
|
100
|
Reach Compliance Code |
not_compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
820 MHz
|
|
Combinatorial Delay of a CLB-Max |
0.35 ns
|
|
JESD-30 Code |
S-PBGA-B1152
|
S-PQFP-G100
|
JESD-609 Code |
e1
|
e4
|
Length |
35 mm
|
14 mm
|
Moisture Sensitivity Level |
4
|
3
|
Number of CLBs |
8448
|
192
|
Number of Equivalent Gates |
6000000
|
50000
|
Number of Terminals |
1152
|
100
|
Organization |
8448 CLBS, 6000000 GATES
|
192 CLBS, 50000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
TFQFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
FLATPACK, THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
245
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.4 mm
|
1.2 mm
|
Supply Voltage-Max |
1.575 V
|
1.26 V
|
Supply Voltage-Min |
1.425 V
|
1.14 V
|
Supply Voltage-Nom |
1.5 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Terminal Finish |
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
1 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
35 mm
|
14 mm
|
Base Number Matches |
1
|
1
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
|
Temperature Grade |
|
OTHER
|
|
|
|
Compare XC2V6000-6FFG1152I with alternatives
Compare XC3S2000-5VQ100C with alternatives