XC3S4000-4FG1156C
vs
XC3S2000-4VQ100C
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
| Part Package Code |
BGA
|
QFP
|
| Package Description |
BGA, BGA1156,34X34,40
|
VQFP-100
|
| Pin Count |
1156
|
100
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Clock Frequency-Max |
630 MHz
|
|
| Combinatorial Delay of a CLB-Max |
0.61 ns
|
|
| JESD-30 Code |
S-PBGA-B1156
|
S-PQFP-G100
|
| JESD-609 Code |
e0
|
e4
|
| Length |
35 mm
|
14 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
6912
|
192
|
| Number of Equivalent Gates |
4000000
|
50000
|
| Number of Inputs |
712
|
|
| Number of Logic Cells |
62208
|
|
| Number of Outputs |
712
|
|
| Number of Terminals |
1156
|
100
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Organization |
6912 CLBS, 4000000 GATES
|
192 CLBS, 50000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
TFQFP
|
| Package Equivalence Code |
BGA1156,34X34,40
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
FLATPACK, THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.6 mm
|
1.2 mm
|
| Supply Voltage-Max |
1.26 V
|
1.26 V
|
| Supply Voltage-Min |
1.14 V
|
1.14 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
1 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Width |
35 mm
|
14 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare XC3S4000-4FG1156C with alternatives
Compare XC3S2000-4VQ100C with alternatives