XPC823ZT50 vs 79RC32H434266BCI feature comparison

XPC823ZT50 Motorola Mobility LLC

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79RC32H434266BCI Integrated Device Technology Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA BGA
Package Description BGA, LBGA, BGA256,16X16,40
Pin Count 256 256
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 26 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 50 MHz 125 MHz
External Data Bus Width 32 32
Format FLOATING POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
Length 23 mm 17 mm
Low Power Mode YES NO
Number of Terminals 256 256
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.35 mm 1.7 mm
Supply Voltage-Max 3.6 V 1.3 V
Supply Voltage-Min 3 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 23 mm 17 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 1
Pbfree Code No
Rohs Code No
Additional Feature ALSO REQUIRES 3.3V SUPPLY
JESD-609 Code e0
Moisture Sensitivity Level 3
Package Equivalence Code BGA256,16X16,40
Peak Reflow Temperature (Cel) 225
Speed 266 MHz
Supply Voltage-Nom 1.2 V
Terminal Finish TIN LEAD
Time@Peak Reflow Temperature-Max (s) 20

Compare XPC823ZT50 with alternatives

Compare 79RC32H434266BCI with alternatives