Part Details for 70T653MS10BC8 by Integrated Device Technology Inc
Overview of 70T653MS10BC8 by Integrated Device Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (5 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for 70T653MS10BC8
70T653MS10BC8 CAD Models
70T653MS10BC8 Part Data Attributes:
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70T653MS10BC8
Integrated Device Technology Inc
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Datasheet
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70T653MS10BC8
Integrated Device Technology Inc
CABGA-256, Reel
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | CABGA | |
| Package Description | BGA-256 | |
| Pin Count | 256 | |
| Manufacturer Package Code | BC256 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 10 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e0 | |
| Length | 17 mm | |
| Memory Density | 18874368 bit | |
| Memory IC Type | MULTI-PORT SRAM | |
| Memory Width | 36 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 2 | |
| Number of Terminals | 256 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 512KX36 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 225 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.5 mm | |
| Standby Current-Max | 0.02 A | |
| Standby Voltage-Min | 2.4 V | |
| Supply Current-Max | 0.81 mA | |
| Supply Voltage-Max (Vsup) | 2.6 V | |
| Supply Voltage-Min (Vsup) | 2.4 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Width | 17 mm |
Alternate Parts for 70T653MS10BC8
This table gives cross-reference parts and alternative options found for 70T653MS10BC8. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 70T653MS10BC8, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 70T653MS10BCG | 512K x 36 Async, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA90/Tray | Renesas Electronics Corporation | 70T653MS10BC8 vs 70T653MS10BCG |
| IDT70T653MS10BC | Dual-Port SRAM, 512KX36, 10ns, CMOS, PBGA256, BGA-256 | Integrated Device Technology Inc | 70T653MS10BC8 vs IDT70T653MS10BC |
| 70T653MS10BCG | CABGA-256, Tray | Integrated Device Technology Inc | 70T653MS10BC8 vs 70T653MS10BCG |
| 70T653MS10BC | 512K x 36 Async, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA90/Tray | Renesas Electronics Corporation | 70T653MS10BC8 vs 70T653MS10BC |
| 70T653MS10BC8 | 512K x 36 Async, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel | Renesas Electronics Corporation | 70T653MS10BC8 vs 70T653MS10BC8 |