Part Details for CY7C09199V-6AC by Rochester Electronics LLC
Overview of CY7C09199V-6AC by Rochester Electronics LLC
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Part Details for CY7C09199V-6AC
CY7C09199V-6AC CAD Models
CY7C09199V-6AC Part Data Attributes
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CY7C09199V-6AC
Rochester Electronics LLC
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Datasheet
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CY7C09199V-6AC
Rochester Electronics LLC
128KX9 DUAL-PORT SRAM, 15ns, PQFP100, PLASTIC, TQFP-100
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
Part Package Code | QFP | |
Package Description | PLASTIC, TQFP-100 | |
Pin Count | 100 | |
Reach Compliance Code | unknown | |
Access Time-Max | 15 ns | |
Additional Feature | FLOW-THROUGH OR PIPELINED ARCHITECTURE | |
JESD-30 Code | S-PQFP-G100 | |
JESD-609 Code | e0 | |
Length | 14 mm | |
Memory Density | 1179648 bit | |
Memory IC Type | DUAL-PORT SRAM | |
Memory Width | 9 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 100 | |
Number of Words | 131072 words | |
Number of Words Code | 128000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 128KX9 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFQFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | COMMERCIAL | |
Seated Height-Max | 1.6 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 3 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 14 mm |