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Microcontrollers and Processors / Microprocessors / TSPC750AVGSB/Q12LE
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TSPC750AVGSB/Q12LE by:

RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CGA-360

Part Details for TSPC750AVGSB/Q12LE by Thales Group

Overview of TSPC750AVGSB/Q12LE by Thales Group

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Part Details for TSPC750AVGSB/Q12LE

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TSPC750AVGSB/Q12LE Part Data Attributes

Parametric Data
TSPC750AVGSB/Q12LE Thales Group
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TSPC750AVGSB/Q12LE Thales Group RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CGA-360
Part Life Cycle Code Obsolete
Ihs Manufacturer THOMSON-CSF SEMICONDUCTORS
Part Package Code CGA
Package Description ,
Pin Count 360
Reach Compliance Code unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 83.3 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-CBGA-B360
Low Power Mode YES
Number of Terminals 360
Operating Temperature-Max 110 °C
Operating Temperature-Min -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Screening Level MIL-STD-883 Class B
Speed 266 MHz
Supply Voltage-Max 2.7 V
Supply Voltage-Min 2.5 V
Supply Voltage-Nom 2.6 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Position BOTTOM
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for TSPC750AVGSB/Q12LE

This table gives cross-reference parts and alternative options found for TSPC750AVGSB/Q12LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSPC750AVGSB/Q12LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
TSPC750AMGS12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation TSPC750AVGSB/Q12LE vs TSPC750AMGS12LE
TSPC750AMGSU12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Teledyne e2v TSPC750AVGSB/Q12LE vs TSPC750AMGSU12LE
TSXPC750AMGSB/Q12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation TSPC750AVGSB/Q12LE vs TSXPC750AMGSB/Q12LE
TSXPC750AMGSU/T12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation TSPC750AVGSB/Q12LE vs TSXPC750AMGSU/T12LE
TSPC750AVGSU12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation TSPC750AVGSB/Q12LE vs TSPC750AVGSU12LE
TSXPC750AMGS12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Teledyne e2v TSPC750AVGSB/Q12LE vs TSXPC750AMGS12LE
TSXPC750AVGS12LH RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation TSPC750AVGSB/Q12LE vs TSXPC750AVGS12LH
TSPC750AVGS12LH RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CGA-360 Thales Group TSPC750AVGSB/Q12LE vs TSPC750AVGS12LH
TSXPC750AMGSU12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation TSPC750AVGSB/Q12LE vs TSXPC750AMGSU12LE
TSPC750AVGS12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Teledyne e2v TSPC750AVGSB/Q12LE vs TSPC750AVGS12LE
Part Number Description Manufacturer Compare
MC7448VS800ND 32-BIT, 800MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, LGA-360 Freescale Semiconductor TSPC750AVGSB/Q12LE vs MC7448VS800ND
MPC8541ECVTAQDX 32-BIT, 1600MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, BGA-360 Freescale Semiconductor TSPC750AVGSB/Q12LE vs MPC8541ECVTAQDX
TSXPC750AVGU/T10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Atmel Corporation TSPC750AVGSB/Q12LE vs TSXPC750AVGU/T10LE
TSXPC750AVGS8LE RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Teledyne e2v TSPC750AVGSB/Q12LE vs TSXPC750AVGS8LE
FWPXA270C0E416 Microprocessor, 416MHz, CMOS, PBGA360, 23 X 23 MM, 1.80 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-360 Marvell Technology Group Ltd TSPC750AVGSB/Q12LE vs FWPXA270C0E416
PC755MZF366LE RISC Microprocessor, 32-Bit, 366MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-360 Atmel Corporation TSPC750AVGSB/Q12LE vs PC755MZF366LE
TSXPC750AMGSU/T10LH RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation TSPC750AVGSB/Q12LE vs TSXPC750AMGSU/T10LH
PC7448FGH1267ND RISC Microprocessor, 32-Bit, 1267MHz, CMOS, CBGA360, 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, BGA-360 Teledyne e2v TSPC750AVGSB/Q12LE vs PC7448FGH1267ND
MPC755BZT300LD RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, PLASTIC, BGA-360 Motorola Semiconductor Products TSPC750AVGSB/Q12LE vs MPC755BZT300LD
TSPC750AMGU12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CERAMIC, BGA-360 Thales Group TSPC750AVGSB/Q12LE vs TSPC750AMGU12LE

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