Part Details for A2F200M3F-FGG256I by Microsemi Corporation
Overview of A2F200M3F-FGG256I by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (3 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Industrial Automation
Financial Technology (Fintech)
Computing and Data Storage
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Aerospace and Defense
Telecommunications
Communication and Networking
Automotive
Part Details for A2F200M3F-FGG256I
A2F200M3F-FGG256I CAD Models
A2F200M3F-FGG256I Part Data Attributes:
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A2F200M3F-FGG256I
Microsemi Corporation
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Datasheet
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A2F200M3F-FGG256I
Microsemi Corporation
Field Programmable Gate Array, 4608 CLBs, 200000 Gates, 80MHz, 4608-Cell, CMOS, PBGA256, 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | LBGA, BGA256,16X16,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Microsemi Corporation | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e3 | |
| Length | 17 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Equivalent Gates | 200000 | |
| Number of Inputs | 117 | |
| Number of Logic Cells | 4608 | |
| Number of Outputs | 117 | |
| Number of Terminals | 256 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 200000 GATES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Peak Reflow Temperature (Cel) | 250 | |
| Programmable Logic Type | FPGA SOC | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.7 mm | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| Supply Voltage-Nom | 1.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 17 mm |
Alternate Parts for A2F200M3F-FGG256I
This table gives cross-reference parts and alternative options found for A2F200M3F-FGG256I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of A2F200M3F-FGG256I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| A2F200M3F-FGG256Y | Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA256, 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | Microsemi Corporation | A2F200M3F-FGG256I vs A2F200M3F-FGG256Y |
| A2F200M3F-FGH256Y | Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA256, 1 MM PITCH, HALOGEN FREE, FBGA-256 | Microsemi Corporation | A2F200M3F-FGG256I vs A2F200M3F-FGH256Y |
| A2F200M3F-FG256Y | Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA256, 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | Microsemi Corporation | A2F200M3F-FGG256I vs A2F200M3F-FG256Y |