Part Details for AM27C256-200PC by AMD
Overview of AM27C256-200PC by AMD
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Price & Stock for AM27C256-200PC
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 58 |
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RFQ | ||
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Bristol Electronics | 6 |
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RFQ | ||
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Quest Components | EPROM, 32K x 8, 28 Pin, Plastic, DIP | 10 |
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$5.5000 / $7.5000 | Buy Now |
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Quest Components | EPROM, 32K x 8, 28 Pin, Plastic, DIP | 4 |
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$39.8020 | Buy Now |
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Chip1Cloud | 256 Kilobit (32 K x 8-Bit) CMOS EPRO | 8 |
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RFQ | |
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Component Electronics, Inc | IN STOCK SHIP TODAY | 2 |
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Buy Now | |
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DISTI #
AM27C256-200PC
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Direct Components, Inc. | 6 |
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RFQ | ||
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Perfect Parts Corporation | 20 |
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RFQ |
Part Details for AM27C256-200PC
AM27C256-200PC CAD Models
AM27C256-200PC Part Data Attributes
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AM27C256-200PC
AMD
Buy Now
Datasheet
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Compare Parts:
AM27C256-200PC
AMD
OTP ROM, 32KX8, 200ns, CMOS, PDIP28, PLASTIC, DIP-28
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Part Package Code | DIP | |
| Package Description | PLASTIC, DIP-28 | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 200 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PDIP-T28 | |
| JESD-609 Code | e0 | |
| Length | 37.084 mm | |
| Memory Density | 262144 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 32KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 12.75 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.715 mm | |
| Standby Current-Max | 0.0001 A | |
| Supply Current-Max | 0.025 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for AM27C256-200PC
This table gives cross-reference parts and alternative options found for AM27C256-200PC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C256-200PC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| WS27C256L-20DMB | UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28 | Waferscale Integration Inc | AM27C256-200PC vs WS27C256L-20DMB |
| NMC87C257Q200 | 32KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28 | Texas Instruments | AM27C256-200PC vs NMC87C257Q200 |
| QP27C256L-200/YA | UVPROM, 32KX8, 200ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | e2v technologies | AM27C256-200PC vs QP27C256L-200/YA |
| 5962-8606301UA | UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 | Waferscale Integration Inc | AM27C256-200PC vs 5962-8606301UA |
| TMS27PC256-2NL4 | 32KX8 OTPROM, 200ns, PDIP28 | Texas Instruments | AM27C256-200PC vs TMS27PC256-2NL4 |
| QP27C256-200/QYA | UVPROM, 32KX8, 200ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | e2v technologies | AM27C256-200PC vs QP27C256-200/QYA |
| NM27LC256Q200 | IC 32K X 8 UVPROM, 200 ns, CDIP28, CERAMIC, DIP-28, Programmable ROM | National Semiconductor Corporation | AM27C256-200PC vs NM27LC256Q200 |
| M38510/22402BYX | UVPROM, 32KX8, 200ns, MOS, 0.5 X 0.625 INCH, DIP-28 | Intel Corporation | AM27C256-200PC vs M38510/22402BYX |
| 27C256MQG/B20 | UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 | e2v technologies | AM27C256-200PC vs 27C256MQG/B20 |
| NM27LC256Q200 | 32KX8 UVPROM, 200ns, CDIP28, CERAMIC, DIP-28 | Texas Instruments | AM27C256-200PC vs NM27LC256Q200 |