Part Details for EP3C10M164C8N by Intel Corporation
Overview of EP3C10M164C8N by Intel Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Industrial Automation
Computing and Data Storage
Telecommunications
Electronic Manufacturing
Price & Stock for EP3C10M164C8N
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
544-3182-ND
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DigiKey | IC FPGA 106 I/O 164MBGA Min Qty: 1 Lead time: 26 Weeks Container: Tray | Temporarily Out of Stock |
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$45.0001 / $47.9000 | Buy Now |
Part Details for EP3C10M164C8N
EP3C10M164C8N CAD Models
EP3C10M164C8N Part Data Attributes:
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EP3C10M164C8N
Intel Corporation
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Datasheet
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EP3C10M164C8N
Intel Corporation
Field Programmable Gate Array, 472.5MHz, 10320-Cell, CMOS, PBGA164, LEAD FREE, MBGA-164
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INTEL CORP | |
Package Description | LEAD FREE, MBGA-164 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Intel | |
Clock Frequency-Max | 472.5 MHz | |
JESD-30 Code | S-PBGA-B164 | |
JESD-609 Code | e1 | |
Length | 8 mm | |
Moisture Sensitivity Level | 3 | |
Number of Inputs | 106 | |
Number of Logic Cells | 10320 | |
Number of Outputs | 106 | |
Number of Terminals | 164 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA164,15X15,20 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.2 mm | |
Supply Voltage-Max | 1.25 V | |
Supply Voltage-Min | 1.15 V | |
Supply Voltage-Nom | 1.2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 8 mm |