Part Details for MC7448TVU1000ND by NXP Semiconductors
Overview of MC7448TVU1000ND by NXP Semiconductors
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for MC7448TVU1000ND
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
89M1963
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Newark | 32-Bit Power Architecture Mpu, 1Ghz, 1Mb L2, Altivec, Mpx/60X Bus/ Tray Rohs Compliant: Yes |Nxp MC7448TVU1000ND Min Qty: 44 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$418.9500 | Buy Now |
DISTI #
MC7448TVU1000ND
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Avnet Americas | MPU MPC74xx RISC 64-Bit 90nm 1GHz 360-Pin FCCBGA Tray - Trays (Alt: MC7448TVU1000ND) RoHS: Compliant Min Qty: 44 Package Multiple: 44 Container: Tray | 0 |
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$396.5624 / $457.3260 | Buy Now |
DISTI #
MC7448TVU1000ND
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Avnet Americas | MPU MPC74xx RISC 64-Bit 90nm 1GHz 360-Pin FCCBGA Tray - Trays (Alt: MC7448TVU1000ND) RoHS: Compliant Min Qty: 44 Package Multiple: 44 Container: Tray | 0 |
|
$396.5624 / $457.3260 | Buy Now |
|
Flip Electronics | Stock | 30 |
|
RFQ |
Part Details for MC7448TVU1000ND
MC7448TVU1000ND CAD Models
MC7448TVU1000ND Part Data Attributes:
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MC7448TVU1000ND
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MC7448TVU1000ND
NXP Semiconductors
32-BIT, 1000MHz, RISC PROCESSOR, CBGA360
|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | BGA, | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.A.1 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | NXP | |
Address Bus Width | ||
Bit Size | 32 | |
Boundary Scan | NO | |
Clock Frequency-Max | 1000 MHz | |
External Data Bus Width | ||
Format | FIXED POINT | |
Integrated Cache | NO | |
JESD-30 Code | S-CBGA-B360 | |
Length | 25 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 1 | |
Number of Terminals | 360 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | ||
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 2.8 mm | |
Speed | 1000 MHz | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 0.95 V | |
Supply Voltage-Nom | 1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 25 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |