Part Details for MPC8548ECVJAQGD by NXP Semiconductors
Overview of MPC8548ECVJAQGD by NXP Semiconductors
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for MPC8548ECVJAQGD
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
85AK9079
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Newark | Fg Pq38 8548 Rev 3 Lead-Free/Tray Rohs Compliant: Yes |Nxp MPC8548ECVJAQGD Min Qty: 36 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$226.7900 | Buy Now |
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DISTI #
MPC8548ECVJAQGD
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Avnet Americas | MPU PowerQUICC III RISC 32-Bit 1000MHz 1.8V/2.5V/3.3V 783-Pin FCP-BGA Tray - Trays (Alt: MPC8548ECVJAQGD) RoHS: Compliant Min Qty: 36 Package Multiple: 36 Container: Tray | 36 |
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RFQ | |
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Rochester Electronics | MPC8548 - PowerQuicc III Integrated Processor RoHS: Compliant Status: Obsolete Min Qty: 1 | 17 |
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$236.0500 / $277.7100 | Buy Now |
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DISTI #
MPC8548ECVJAQGD
|
Avnet Americas | MPU PowerQUICC III RISC 32-Bit 1000MHz 1.8V/2.5V/3.3V 783-Pin FCP-BGA Tray - Trays (Alt: MPC8548ECVJAQGD) RoHS: Compliant Min Qty: 36 Package Multiple: 36 Container: Tray | 36 |
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RFQ | |
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Chip1Cloud | IC MPU MPC85XX 1.0GHZ 783FCBGA | 2010 |
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RFQ |
Part Details for MPC8548ECVJAQGD
MPC8548ECVJAQGD CAD Models
MPC8548ECVJAQGD Part Data Attributes:
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MPC8548ECVJAQGD
NXP Semiconductors
Buy Now
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Compare Parts:
MPC8548ECVJAQGD
NXP Semiconductors
32-BIT, 1000MHz, RISC PROCESSOR, PBGA783
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | BGA, BGA783,28X28,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.1 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | NXP | |
| JESD-30 Code | S-PBGA-B783 | |
| JESD-609 Code | e2 | |
| Length | 29 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 783 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA783,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.38 mm | |
| Supply Voltage-Max | 1.155 V | |
| Supply Voltage-Min | 1.045 V | |
| Supply Voltage-Nom | 1.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Silver (Sn/Ag) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 29 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |