Part Details for OMAP3530ECBBA by Texas Instruments
Overview of OMAP3530ECBBA by Texas Instruments
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Industrial Automation
Agriculture Technology
Electronic Manufacturing
Robotics and Drones
Price & Stock for OMAP3530ECBBA
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
296-41523-ND
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DigiKey | IC MPU OMAP-35XX 600MHZ 515FCBGA Min Qty: 1 Lead time: 6 Weeks Container: Tray |
80 In Stock |
|
$52.2251 / $61.9900 | Buy Now |
|
DISTI #
595-OMAP3530ECBBA
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Mouser Electronics | Processors - Application Specialized Applications Proc RoHS: Compliant | 336 |
|
$53.4500 / $60.7700 | Buy Now |
|
DISTI #
V99:2348_07303302
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Arrow Electronics | SOC OMAP3 ARM Cortex A8 65nm 515-Pin POP-FCBGA Tray RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 6 Weeks Date Code: 2011 | Americas - 51 |
|
$47.7200 / $52.8600 | Buy Now |
|
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Ameya Holding Limited | IC MPU OMAP-35XX 600MHZ 515FCBGA | 3122 |
|
RFQ |
Part Details for OMAP3530ECBBA
OMAP3530ECBBA CAD Models
OMAP3530ECBBA Part Data Attributes:
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OMAP3530ECBBA
Texas Instruments
Buy Now
Datasheet
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OMAP3530ECBBA
Texas Instruments
Applications Processor 515-POP-FCBGA -40 to 105
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Part Package Code | BGA | |
| Pin Count | 515 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A992.C | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | Texas Instruments | |
| JESD-30 Code | S-PBGA-B515 | |
| JESD-609 Code | e1 | |
| Length | 12 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 515 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA515,28X28,16 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 0.9 mm | |
| Speed | 720 MHz | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.4 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 12 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |