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Manufacturer: Spansion Sorted By: Technology
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S29GL064M90FFIR52
Spansion
Check for Price Yes Obsolete 67.1089 Mbit 16 32K 4MX16 3.3 V 90 ns FLASH TOP BOOT BLOCK TOP YES YES YES 1 128 4000000 4.1943 M ASYNCHRONOUS 4 words PARALLEL 3 V YES 5 µA 60 µA 3.6 V 3 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B64 Not Qualified e1 3 85 °C -40 °C 260 40 64 PLASTIC/EPOXY LBGA BGA64,8X8,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC BGA LBGA, BGA64,8X8,40 64 unknown EAR99 8542.32.00.51
S29CD032J1JBFM020
Spansion
Check for Price Yes Transferred 33.5544 Mbit 32 2K,16K 1MX32 2.6 V 54 ns FLASH TOP YES YES YES 1 16,62 1000000 1.0486 M SYNCHRONOUS PARALLEL 2.7 V YES 60 µA 90 µA 2.75 V 2.5 V CMOS AUTOMOTIVE YES NOR TYPE R-PBGA-B80 Not Qualified 125 °C -40 °C 80 PLASTIC/EPOXY LBGA BGA80,8X10,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES BALL 1 mm BOTTOM 1.4 mm 11 mm 9 mm SPANSION INC LBGA, BGA80,8X10,40 unknown EAR99 8542.32.00.51
S29GL032A11TAIR22
Spansion
Check for Price No Obsolete 33.5544 Mbit 16 64K 2MX16 3.3 V 110 ns FLASH 8 YES YES YES 1 64 2000000 2.0972 M ASYNCHRONOUS 4/8 words PARALLEL 3 V YES 5 µA 60 µA 3.6 V 3 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e0 3 85 °C -40 °C 260 56 PLASTIC/EPOXY TSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES TIN LEAD GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 MO-142EC, TSOP-56 56 not_compliant EAR99 8542.32.00.51
S29CL016J1JBFM012
Spansion
Check for Price Yes Transferred 16.7772 Mbit 32 2K,16K 512KX32 3.3 V 54 ns FLASH BOTTOM YES YES YES 1 16,30 512000 524.288 k SYNCHRONOUS PARALLEL 2.7 V YES 60 µA 90 µA 3.6 V 3 V CMOS AUTOMOTIVE YES NOR TYPE R-PBGA-B80 Not Qualified 125 °C -40 °C 80 PLASTIC/EPOXY LBGA BGA80,8X10,32 RECTANGULAR GRID ARRAY, LOW PROFILE YES BALL 1 mm BOTTOM 1.4 mm 11 mm 9 mm SPANSION INC LBGA, BGA80,8X10,32 unknown EAR99 8542.32.00.51
AM29LV256MH109FI
Spansion
Check for Price No Obsolete 268.4355 Mbit 16 64K 16MX16 3 V 100 ns FLASH 8 BOTTOM/TOP YES YES YES 1 512 16000000 16.7772 M ASYNCHRONOUS 4/8 words PARALLEL 3 V YES YES 5 µA 60 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e0 3 85 °C -40 °C 260 56 PLASTIC/EPOXY TSOP1-R TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES TIN LEAD GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 REVERSE, MO-142B, TSOP-56 56 not_compliant EAR99 8542.32.00.51
AM29LV200BB-120WAD
Spansion
Check for Price Yes Obsolete 2.0972 Mbit 16 128KX16 3 V 120 ns FLASH BOTTOM BOOT BLOCK 8 1 128000 131.072 k ASYNCHRONOUS PARALLEL 3 V 3.6 V 2.7 V CMOS COMMERCIAL R-PBGA-B48 Not Qualified e1 3 70 °C 260 40 48 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 8.15 mm 6.15 mm SPANSION INC BGA TFBGA, 48 compliant
AM29SL800DT150WAD
Spansion
Check for Price Yes Obsolete 8.3886 Mbit 16 16K,8K,32K,64K 512KX16 1.8 V 150 ns FLASH TOP BOOT BLOCK 8 TOP YES YES 1000000 Write/Erase Cycles 1 1,2,1,15 512000 524.288 k ASYNCHRONOUS PARALLEL 1.8 V YES 5 µA 30 µA 2.2 V 1.65 V CMOS COMMERCIAL YES NOR TYPE R-PBGA-B48 Not Qualified e1 3 70 °C 260 40 48 PLASTIC/EPOXY TFBGA BGA48,6X8,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) BALL 800 µm BOTTOM 1.2 mm 8.15 mm 6.15 mm SPANSION INC BGA 8.15 X 6.15 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48 48 compliant EAR99 8542.32.00.51
AM29F400BB-120DGI2
Spansion
Check for Price No Obsolete 4.1943 Mbit 16 16K,8K,32K,64K 256KX16 5 V 120 ns FLASH BOTTOM BOOT BLOCK 8 BOTTOM YES YES 1000000 Write/Erase Cycles 1 1,2,1,7 256000 262.144 k ASYNCHRONOUS PARALLEL 5 V YES 5.5 V 4.5 V CMOS INDUSTRIAL YES NOR TYPE R-XUUC-N43 Not Qualified e0 85 °C -40 °C 43 UNSPECIFIED DIE DIE OR CHIP RECTANGULAR UNCASED CHIP YES TIN LEAD NO LEAD UPPER SPANSION INC DIE DIE, DIE OR CHIP 43 compliant EAR99 8542.32.00.51
AM29LV010B-55JCB
Spansion
Check for Price No No Obsolete 1.0486 Mbit 8 128KX8 3 V 55 ns FLASH 1 128000 131.072 k ASYNCHRONOUS PARALLEL 3 V 3.6 V 2.7 V CMOS COMMERCIAL NOR TYPE R-PQCC-J32 Not Qualified e0 2 70 °C NOT SPECIFIED NOT SPECIFIED 32 PLASTIC/EPOXY QCCJ RECTANGULAR CHIP CARRIER YES Tin/Lead (Sn/Pb) J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm SPANSION INC QFJ PLASTIC, LCC-32 32 compliant EAR99 8542.32.00.51
S29CD032J0RQFM030
Spansion
Check for Price Yes Transferred 33.5544 Mbit 32 2K,16K 1MX32 2.6 V 48 ns FLASH SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK BOTTOM YES YES YES 1 16,62 1000000 1.0486 M ASYNCHRONOUS PARALLEL 2.7 V YES 60 µA 90 µA 2.75 V 2.5 V CMOS AUTOMOTIVE YES NOR TYPE R-PQFP-G80 Not Qualified e3 3 125 °C -40 °C 260 40 80 PLASTIC/EPOXY QFP QFP80,.7X.9,32 RECTANGULAR FLATPACK YES MATTE TIN GULL WING 800 µm QUAD 3.35 mm 20 mm 14 mm SPANSION INC QFP QFP, QFP80,.7X.9,32 80 unknown EAR99 8542.32.00.51