Parametric results for: 白城洮北spa哪里好+聯_系Φ319337670 under Flash Memories

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Manufacturer: Spansion Sorted By: Clock Frequency-Max (fCLK)
Select parts from the table below to compare.
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S25FL512SAGMFVG13
Spansion
Check for Price Yes Transferred 536.8709 Mbit 4 128MX4 3 V 133 MHz FLASH IT ALSO HAVE MEMORY WIDTH X1 2 20 100000 Write/Erase Cycles 1 128000000 134.2177 M SYNCHRONOUS SERIAL 3 V SPI 100 µA 61 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE R-PDSO-G16 Not Qualified 105 °C -40 °C 16 PLASTIC/EPOXY SOP SOP16,.4 RECTANGULAR SMALL OUTLINE YES GULL WING 1.27 mm DUAL 2.65 mm 10.3 mm 7.5 mm SPANSION INC SOIC-16 compliant 3A991.B.1.A 8542.32.00.51
S25FL256SAGBHV210
Spansion
Check for Price Yes Transferred 268.4355 Mbit 8 32MX8 3 V 133 MHz FLASH ALSO CONFIGURABLE AS 128M X 1 2 20 100000 Write/Erase Cycles 1 32000000 33.5544 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 300 µA 100 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE 500 ms HARDWARE/SOFTWARE R-PBGA-B24 Not Qualified 105 °C -40 °C 24 PLASTIC/EPOXY TBGA BGA24,5X5,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES BALL 1 mm BOTTOM 1.2 mm 8 mm 6 mm SPANSION INC TBGA, BGA24,5X5,40 unknown EAR99 8542.32.00.51 BGA 24
S25FL128SAGBHVD13
Spansion
Check for Price Yes Transferred 134.2177 Mbit 8 16MX8 3 V 133 MHz FLASH ALSO CONFIGURABLE AS 128M X 1 2 20 100000 Write/Erase Cycles 1 16000000 16.7772 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 300 µA 100 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE 500 ms HARDWARE/SOFTWARE R-PBGA-B24 Not Qualified 105 °C -40 °C 24 PLASTIC/EPOXY TBGA BGA24,4X6,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES BALL 1 mm BOTTOM 1.2 mm 8 mm 6 mm SPANSION INC TBGA, BGA24,4X6,40 unknown EAR99 8542.32.00.51 BGA 24
S25FL512SAGBHVB13
Spansion
Check for Price Yes Transferred 536.8709 Mbit 4 128MX4 3 V 133 MHz FLASH IT ALSO HAVE MEMORY WIDTH X1 2 20 100000 Write/Erase Cycles 1 128000000 134.2177 M SYNCHRONOUS SERIAL 3 V SPI 300 µA 61 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE R-PBGA-B24 Not Qualified 105 °C -40 °C 24 PLASTIC/EPOXY TBGA BGA24,4X6,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES BALL 1 mm BOTTOM 1.2 mm 8 mm 6 mm SPANSION INC FBGA-24 compliant 3A991.B.1.A 8542.32.00.51
S25FL256SDPMFIR13
Spansion
Check for Price Transferred 268.4355 Mbit 8 32MX8 3 V 133 MHz FLASH 1 32000000 33.5544 M SYNCHRONOUS 3-STATE SERIAL 3 V 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE 85 °C -40 °C SOP 1.27 mm 2.65 mm 10.3 mm 7.5 mm SPANSION INC 0.300 INCH, LEAD FREE, PLASTIC, MS-013EAA, SOIC-16 unknown 3A991.B.1.A 8542.32.00.51 SOIC 16
S25FL256SAGBHIB00
Spansion
Check for Price Yes Transferred 268.4355 Mbit 8 32MX8 3 V 133 MHz FLASH ALSO CONFIGURABLE AS 128M X 1 2 20 100000 Write/Erase Cycles 1 32000000 33.5544 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 100 µA 100 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE 500 ms HARDWARE/SOFTWARE R-PBGA-B24 Not Qualified 85 °C -40 °C 24 PLASTIC/EPOXY TBGA BGA24,4X6,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES BALL 1 mm BOTTOM 1.2 mm 8 mm 6 mm SPANSION INC FBGA-24 compliant 3A991.B.1.A 8542.32.00.51 BGA 24
S25FL256SDPMFIG10
Spansion
Check for Price Yes Transferred 268.4355 Mbit 8 32MX8 3 V 133 MHz FLASH 20 100000 Write/Erase Cycles 1 32000000 33.5544 M SYNCHRONOUS SERIAL 3 V SPI 100 µA 100 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE 500 ms HARDWARE/SOFTWARE R-PDSO-G16 Not Qualified 85 °C -40 °C 16 PLASTIC/EPOXY SOP SOP16,.4 RECTANGULAR SMALL OUTLINE YES GULL WING 1.27 mm DUAL 2.65 mm 10.3 mm 7.5 mm SPANSION INC SOIC-16 compliant 3A991.B.1.A 8542.32.00.51
S25FL128SAGBHVB03
Spansion
Check for Price Yes Transferred 134.2177 Mbit 8 16MX8 3 V 133 MHz FLASH ALSO CONFIGURABLE AS 128M X 1 2 20 100000 Write/Erase Cycles 1 16000000 16.7772 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 300 µA 100 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE 500 ms HARDWARE/SOFTWARE R-PBGA-B24 Not Qualified 105 °C -40 °C 24 PLASTIC/EPOXY TBGA BGA24,5X5,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES BALL 1 mm BOTTOM 1.2 mm 8 mm 6 mm SPANSION INC FBGA-24 compliant EAR99 8542.32.00.51 BGA 24
S70FL512SAGMFI013
Spansion
Check for Price Obsolete 536.8709 Mbit 1 512MX1 3 V 133 MHz FLASH 20 1 512000000 536.8709 M SYNCHRONOUS SERIAL 3 V 20 µA 44 µA 3.6 V 2.7 V CMOS INDUSTRIAL R-PDSO-G16 85 °C -40 °C 16 PLASTIC/EPOXY SOP SOP16,.4 RECTANGULAR SMALL OUTLINE YES GULL WING 1.27 mm DUAL 2.65 mm 10.3 mm 7.5 mm SPANSION INC SOP, unknown EAR99 8542.32.00.51 SOIC 16
S25FL256SDPBHI300
Spansion
Check for Price Transferred 268.4355 Mbit 8 32MX8 3 V 133 MHz FLASH 1 32000000 33.5544 M SYNCHRONOUS 3-STATE SERIAL 3 V 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE R-PBGA-B24 85 °C -40 °C TBGA BGA24,4X6,40 GRID ARRAY, THIN PROFILE YES BALL 1 mm BOTTOM 1.2 mm 8 mm 6 mm SPANSION INC 6 X 8 MM, 1 MM PITCH, LEAD FREE, BGA-24 unknown 3A991.B.1.A 8542.32.00.51 BGA 24