Parametric results for: 白城洮北spa哪里好+聯_系Φ319337670 under Flash Memories

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Manufacturer: Spansion
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S25FL216K0PMFI040
Spansion
$0.2460 Yes Obsolete 16.7772 Mbit 8 2MX8 3 V 65 MHz FLASH 20 100000 Write/Erase Cycles 1 2000000 2.0972 M SYNCHRONOUS SERIAL 3 V SPI 32 µA 25 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE R-PDSO-G8 Not Qualified 85 °C -40 °C 8 PLASTIC/EPOXY SOP SOP8,.25 RECTANGULAR SMALL OUTLINE YES GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm SPANSION INC SOIC-8 compliant 3A991.B.1.A 8542.32.00.51
S25FL216K0PMFI011
Spansion
$0.2675 Yes Obsolete 16.7772 Mbit 8 2MX8 3 V 65 MHz FLASH 20 100000 Write/Erase Cycles 1 2000000 2.0972 M SYNCHRONOUS SERIAL 3 V SPI 32 µA 25 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE S-PDSO-G8 Not Qualified 85 °C -40 °C 8 PLASTIC/EPOXY SOP SOP8,.3 SQUARE SMALL OUTLINE YES GULL WING 1.27 mm DUAL 2.159 mm 5.283 mm 5.283 mm SPANSION INC SOIC-8 compliant 3A991.B.1.A 8542.32.00.51 Spansion
S25FL216K0PMFI013
Spansion
$0.3541 Yes Obsolete 16.7772 Mbit 8 2MX8 3 V 65 MHz FLASH 20 100000 Write/Erase Cycles 1 2000000 2.0972 M SYNCHRONOUS SERIAL 3 V SPI 32 µA 25 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE S-PDSO-G8 Not Qualified 85 °C -40 °C 8 PLASTIC/EPOXY SOP SOP8,.3 SQUARE SMALL OUTLINE YES GULL WING 1.27 mm DUAL 2.159 mm 5.283 mm 5.283 mm SPANSION INC SOIC-8 compliant 3A991.B.1.A 8542.32.00.51
S25FL032P0XMFI011
Spansion
$0.5630 Yes Transferred 65.536 kbit 16 4KX16 3 V 104 MHz FLASH 20 100000 Write/Erase Cycles 1 4000 4.096 k SYNCHRONOUS SERIAL 3 V SPI 10 µA 38 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE S-PDSO-N8 Not Qualified 85 °C -40 °C 260 40 8 PLASTIC/EPOXY SON SOP8,.3 SQUARE SMALL OUTLINE YES NO LEAD 1.27 mm DUAL 2.159 mm 5.283 mm 5.283 mm SPANSION INC 0.208 INCH, LEAD FREE, PLASTIC, SOP-8 compliant 3A991.B.1.A 8542.32.00.51 Spansion SOIC 8
S29AL016J70TFI020
Spansion
$0.5810 Yes Yes Transferred 16.7772 Mbit 16 16K,8K,32K,64K 1MX16 3 V 70 ns FLASH BOTTOM BOOT BLOCK 8 BOTTOM YES YES YES 1 1,2,1,31 1000000 1.0486 M ASYNCHRONOUS PARALLEL 3 V YES 5 µA 30 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G48 Not Qualified e3 3 85 °C -40 °C 260 40 48 PLASTIC/EPOXY TSSOP TSSOP48,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 12 mm SPANSION INC LEAD FREE, MO-142DDD, TSOP-48 compliant EAR99 8542.32.00.51 Spansion TSOP1 48
S29AL008J70BFI010
Spansion
$0.6260 Yes Yes Transferred 8.3886 Mbit 16 8K,4K,16K,32K 512KX16 3 V 70 ns FLASH TOP BOOT BLOCK 8 TOP YES YES YES 1 1,2,1,15 512000 524.288 k ASYNCHRONOUS PARALLEL 3 V YES 5 µA 12 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B48 Not Qualified e1 3 85 °C -40 °C 260 40 48 PLASTIC/EPOXY VFBGA BGA48,6X8,32 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1 mm 8.15 mm 6.15 mm SPANSION INC 8.15 X 6.15 MM, 0.80 MM PITCH, LEAD FREE, FPBGA-48 compliant EAR99 8542.32.00.51 BGA 48
S25FL032P0XNFI011
Spansion
$0.6559 Yes Transferred 65.536 kbit 16 4KX16 3 V 104 MHz FLASH 20 100000 Write/Erase Cycles 1 4000 4.096 k SYNCHRONOUS SERIAL 3 V SPI 10 µA 38 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE R-PDSO-N8 Not Qualified 85 °C -40 °C 260 40 8 PLASTIC/EPOXY HVSON SOLCC8,.25 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES NO LEAD 1.27 mm DUAL 800 µm 8 mm 6 mm SPANSION INC 6 X 8 MM, LEAD FREE, PLASTIC, WSON-8 compliant 3A991.B.1.A 8542.32.00.51 Spansion SON 8
S25FL032P0XMFI001
Spansion
$0.6900 Yes Transferred 65.536 kbit 16 4KX16 3 V 104 MHz FLASH 20 100000 Write/Erase Cycles 1 4000 4.096 k SYNCHRONOUS SERIAL 3 V SPI 10 µA 38 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE R-PDSO-N16 Not Qualified 85 °C -40 °C 260 40 16 PLASTIC/EPOXY SON SOP16,.4 RECTANGULAR SMALL OUTLINE YES NO LEAD 1.27 mm DUAL 2.65 mm 10.3 mm 7.5 mm SPANSION INC 0.300 INCH, LEAD FREE, MS-013DAA, SOP-16 compliant 3A991.B.1.A 8542.32.00.51 Spansion SOIC 16
S29AL016J70BFI010
Spansion
$0.7188 Yes Yes Transferred 16.7772 Mbit 16 16K,8K,32K,64K 1MX16 3 V 70 ns FLASH TOP BOOT BLOCK 8 TOP YES YES YES 1 1,2,1,31 1000000 1.0486 M ASYNCHRONOUS PARALLEL 3 V YES 5 µA 30 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B48 Not Qualified e1 3 85 °C -40 °C 260 40 48 PLASTIC/EPOXY VFBGA BGA48,6X8,32 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1 mm 8.15 mm 6.15 mm SPANSION INC 8.15 X 6.15 MM, 0.80 MM PITCH, LEAD FREE, FPBGA-48 compliant EAR99 8542.32.00.51 BGA 48
S29AL008J55TFIR20
Spansion
$0.7370 Yes Transferred 8.3886 Mbit 16 8K,4K,16K,32K 512KX16 3.3 V 55 ns FLASH BOTTOM BOOT BLOCK 8 BOTTOM YES YES YES 1 1,2,1,15 512000 524.288 k ASYNCHRONOUS PARALLEL 3 V YES 5 µA 12 µA 3.6 V 3 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G48 Not Qualified e3 3 85 °C -40 °C 260 40 48 PLASTIC/EPOXY TSSOP TSSOP48,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 12 mm SPANSION INC LEAD FREE, MO-142DDD, TSOP-48 compliant EAR99 8542.32.00.51 TSOP1 48