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Manufacturer: Spansion
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S25FL064P0XNFI001
Spansion
$0.9170 Yes Transferred 67.1089 Mbit 8 8MX8 3 V 104 MHz FLASH 20 100000 Write/Erase Cycles 1 8000000 8.3886 M SYNCHRONOUS 3-STATE SERIAL 3 V QSPI 10 µA 38 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE R-PDSO-N8 Not Qualified e3 3 85 °C -40 °C 260 40 8 PLASTIC/EPOXY VSON SOLCC8,.3 RECTANGULAR SMALL OUTLINE, VERY THIN PROFILE YES MATTE TIN NO LEAD 1.27 mm DUAL 800 µm 8 mm 6 mm SPANSION INC SON 6 X 8 MM, LEAD FREE, PLASTIC, WSON-8 8 compliant 3A991.B.1.A 8542.32.00.51 Spansion
S29GL064N90TFI030
Spansion
$0.9500 Yes Yes Transferred 67.1089 Mbit 16 8K,64K 4MX16 3 V 90 ns FLASH 8 TOP YES YES YES 1 8,127 4000000 4.1943 M ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 50 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G48 Not Qualified e3 3 85 °C -40 °C 260 40 48 PLASTIC/EPOXY TSSOP TSSOP48,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 12 mm SPANSION INC TSOP1 LEAD FREE, MO-142EC, TSOP-48 48 compliant 3A991.B.1.A 8542.32.00.51 Spansion
S29GL064N90BFI030
Spansion
$0.9500 Yes Yes Transferred 67.1089 Mbit 16 8K,64K 4MX16 3 V 90 ns FLASH 8 TOP YES YES YES 1 8,127 4000000 4.1943 M ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 50 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B48 Not Qualified e1 3 85 °C -40 °C 260 40 48 PLASTIC/EPOXY VFBGA BGA48,6X8,32 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1 mm 8.15 mm 6.15 mm SPANSION INC BGA 8.15 X 6.15 MM, LEAD FREE, FBGA-48 48 compliant 3A991.B.1.A 8542.32.00.51 Spansion
S29AL008J70TFI010
Spansion
$1.0200 Yes Yes Transferred 8.3886 Mbit 16 8K,4K,16K,32K 512KX16 3 V 70 ns FLASH TOP BOOT BLOCK 8 TOP YES YES YES 1 1,2,1,15 512000 524.288 k ASYNCHRONOUS PARALLEL 3 V YES 5 µA 12 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G48 Not Qualified e3 3 85 °C -40 °C 260 40 48 PLASTIC/EPOXY TSSOP TSSOP48,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 12 mm SPANSION INC TSOP1 LEAD FREE, MO-142DDD, TSOP-48 48 compliant EAR99 8542.32.00.51 Spansion
S29GL064N90TFI060
Spansion
$1.0300 Yes Yes Transferred 67.1089 Mbit 16 32K 4MX16 3 V 90 ns FLASH YES YES YES 1 128 4000000 4.1943 M ASYNCHRONOUS 8 words PARALLEL 3 V YES 5 µA 50 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G48 Not Qualified e3 3 85 °C -40 °C 260 40 48 PLASTIC/EPOXY TSSOP TSSOP48,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 12 mm SPANSION INC TSOP1 LEAD FREE, MO-142EC, TSOP-48 48 compliant 3A991.B.1.A 8542.32.00.51 Spansion
S29GL064N90TFI020
Spansion
$1.0500 Yes Yes Transferred 67.1089 Mbit 16 64K 4MX16 3 V 90 ns FLASH 8 YES YES YES 1 128 4000000 4.1943 M ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 50 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e3 3 85 °C -40 °C 260 40 56 PLASTIC/EPOXY TSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 LEAD FREE, MO-142EC, TSOP-56 56 compliant 3A991.B.1.A 8542.32.00.51 Spansion
S25FL064P0XMFI003
Spansion
$1.0594 Yes Transferred 67.1089 Mbit 8 8MX8 3 V 104 MHz FLASH 20 100000 Write/Erase Cycles 1 8000000 8.3886 M SYNCHRONOUS 3-STATE SERIAL 3 V QSPI 10 µA 38 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE R-PDSO-G16 Not Qualified e3 3 85 °C -40 °C 260 40 16 PLASTIC/EPOXY SOP SOP16,.4 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 2.65 mm 10.3 mm 7.5 mm SPANSION INC SOIC 0.300 INCH, LEAD FREE, PLASTIC, MS-013DAA, SOP-16 16 compliant 3A991.B.1.A 8542.32.00.51
S29GL064N90FFI020
Spansion
$1.0900 Yes Yes Transferred 67.1089 Mbit 16 64K 4MX16 3 V 90 ns FLASH 8 YES YES YES 1 128 4000000 4.1943 M ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 50 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B64 Not Qualified e1 3 85 °C -40 °C 260 40 64 PLASTIC/EPOXY LBGA BGA64,8X8,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC BGA 13 X 11 MM, LEAD FREE, FBGA-64 64 compliant 3A991.B.1.A 8542.32.00.51
S29GL064N90FFI010
Spansion
$1.0900 Yes Yes Transferred 67.1089 Mbit 16 64K 4MX16 3 V 90 ns FLASH 8 YES YES YES 1 128 4000000 4.1943 M ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 50 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B64 Not Qualified e1 3 85 °C -40 °C 260 40 64 PLASTIC/EPOXY LBGA BGA64,8X8,40 RECTANGULAR GRID ARRAY, LOW PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.4 mm 13 mm 11 mm SPANSION INC BGA 13 X 11 MM, LEAD FREE, FBGA-64 64 compliant 3A991.B.1.A 8542.32.00.51
S29GL064N90TFI040
Spansion
$1.0900 Yes Yes Transferred 67.1089 Mbit 16 8K,64K 4MX16 3 V 90 ns FLASH 8 BOTTOM YES YES YES 1 8,127 4000000 4.1943 M ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 50 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G48 Not Qualified e3 3 85 °C -40 °C 260 40 48 PLASTIC/EPOXY TSSOP TSSOP48,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 12 mm SPANSION INC TSOP1 LEAD FREE, MO-142EC, TSOP-48 48 compliant 3A991.B.1.A 8542.32.00.51 Spansion