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Manufacturer: Spansion
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S29GL128S10TFI010
Spansion
$1.5900 Yes Transferred 134.2177 Mbit 8 64K 16MX8 3 V 100 ns FLASH YES YES YES 1 128 16000000 16.7772 M ASYNCHRONOUS 16 words PARALLEL 2.7 V YES 100 µA 80 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified 85 °C -40 °C 56 PLASTIC/EPOXY TSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 14 X 20 MM, LEAD FREE, MO-142BEC, TSOP-56 56 compliant 3A991.B.1.A 8542.32.00.51 Spansion
S29GL128S10TFI020
Spansion
$1.5900 Yes Transferred 134.2177 Mbit 8 64K 16MX8 3 V 100 ns FLASH YES YES YES 1 128 16000000 16.7772 M ASYNCHRONOUS 16 words PARALLEL 2.7 V YES 100 µA 80 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified 85 °C -40 °C 56 PLASTIC/EPOXY TSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 14 X 20 MM, LEAD FREE, MO-142BEC, TSOP-56 56 compliant 3A991.B.1.A 8542.32.00.51
S29GL128S10DHIV20
Spansion
$1.6300 Yes Transferred 134.2177 Mbit 8 64K 16MX8 3 V 100 ns FLASH YES YES YES 1 128 16000000 16.7772 M ASYNCHRONOUS 16 words PARALLEL 2.7 V YES 100 µA 80 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE S-PBGA-B64 Not Qualified 85 °C -40 °C 64 PLASTIC/EPOXY LBGA BGA64,8X8,40 SQUARE GRID ARRAY, LOW PROFILE YES BALL 1 mm BOTTOM 1.4 mm 9 mm 9 mm SPANSION INC BGA LEAD FREE, PACKAGE 64 compliant 3A991.B.1.A 8542.32.00.51 Spansion
S25FL127SABMFI101
Spansion
$1.6360 Yes Transferred 134.2177 Mbit 8 16MX8 3 V 108 MHz FLASH 20 100000 Write/Erase Cycles 1 16000000 16.7772 M SYNCHRONOUS SERIAL 3 V SPI 100 µA 63 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE HARDWARE/SOFTWARE S-PDSO-G8 Not Qualified 85 °C -40 °C 8 PLASTIC/EPOXY SOP SOP8,.3 SQUARE SMALL OUTLINE YES GULL WING 1.27 mm DUAL 2.159 mm 5.283 mm 5.283 mm SPANSION INC SOIC-8 compliant 3A991.B.1.A 8542.32.00.51 Spansion
S34ML01G100TFI000
Spansion
$1.6500 Yes Transferred 1.0737 Gbit 8 128K 128MX8 3.3 V 25 ns FLASH YES NO NO 10 1 1K 128000000 134.2177 M ASYNCHRONOUS 2K words PARALLEL 3.3 V YES 10 µA 35 µA 3.6 V 2.7 V CMOS INDUSTRIAL NO SLC NAND TYPE R-PDSO-G48 Not Qualified e3 3 85 °C -40 °C 260 40 48 PLASTIC/EPOXY TSOP1 TSSOP48,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 12 mm SPANSION INC 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, PLASTIC, MO-142DDD, TSOP1-48 compliant 3A991.B.1.A 8542.32.00.51 Spansion
S34ML01G100BHI000
Spansion
$1.6500 Yes Transferred 1.0737 Gbit 8 128K 128MX8 3.3 V 25 ns FLASH YES NO NO 10 1 1K 128000000 134.2177 M ASYNCHRONOUS 2K words PARALLEL 3.3 V YES 10 µA 35 µA 3.6 V 2.7 V CMOS INDUSTRIAL NO SLC NAND TYPE R-PBGA-B63 Not Qualified 85 °C -40 °C 63 PLASTIC/EPOXY VFBGA BGA63,10X12,32 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 1 mm 11 mm 9 mm SPANSION INC 11 X 9 MM, 1 MM HEIGHT, LOW HALOGEN AND LEAD FREE, MO-207M, BGA-63 compliant 3A991.B.1.A 8542.32.00.51 Spansion
S29GL064N90TFI010
Spansion
$1.6835 Yes Yes Transferred 67.1089 Mbit 16 64K 4MX16 3 V 90 ns FLASH 8 YES YES YES 1 128 4000000 4.1943 M ASYNCHRONOUS 8/16 words PARALLEL 3 V YES 5 µA 50 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PDSO-G56 Not Qualified e3 3 85 °C -40 °C 260 40 56 PLASTIC/EPOXY TSSOP TSSOP56,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 14 mm SPANSION INC TSOP1 LEAD FREE, MO-142EC, TSOP-56 56 compliant 3A991.B.1.A 8542.32.00.51 Spansion
S25FL128SAGBHI200
Spansion
$1.7500 Yes Transferred 134.2177 Mbit 8 16MX8 3 V 133 MHz FLASH ALSO CONFIGURABLE AS 128M X 1 2 20 100000 Write/Erase Cycles 1 16000000 16.7772 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 100 µA 100 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE 500 ms HARDWARE/SOFTWARE R-PBGA-B24 Not Qualified 85 °C -40 °C 24 PLASTIC/EPOXY TBGA BGA24,5X5,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES BALL 1 mm BOTTOM 1.2 mm 8 mm 6 mm SPANSION INC BGA FBGA-24 24 compliant 3A991.B.1.A 8542.32.00.51 Spansion
S25FL128SAGNFI011
Spansion
$1.7500 Yes Transferred 134.2177 Mbit 8 16MX8 3 V 133 MHz FLASH 2 20 100000 Write/Erase Cycles 1 16000000 16.7772 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 100 µA 100 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE 500 ms HARDWARE/SOFTWARE R-PDSO-N8 Not Qualified 85 °C -40 °C 8 PLASTIC/EPOXY HVSON SOLCC8,.3 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES NO LEAD 1.27 mm DUAL 800 µm 8 mm 6 mm SPANSION INC SON WSON-8 8 compliant 3A991.B.1.A 8542.32.00.51 Spansion
S25FL128SAGNFI001
Spansion
$1.7500 Yes Transferred 134.2177 Mbit 8 16MX8 3 V 133 MHz FLASH 2 20 100000 Write/Erase Cycles 1 16000000 16.7772 M SYNCHRONOUS 3-STATE SERIAL 3 V SPI 100 µA 100 µA 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE 500 ms HARDWARE/SOFTWARE R-PDSO-N8 Not Qualified 85 °C -40 °C 260 40 8 PLASTIC/EPOXY HVSON SOLCC8,.3 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES NO LEAD 1.27 mm DUAL 800 µm 8 mm 6 mm SPANSION INC SON WSON-8 8 compliant 3A991.B.1.A 8542.32.00.51 Spansion