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S25FS512SAGBHI210
Spansion
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Check for Price | Transferred | 536.8709 Mbit | 8 | 64MX8 | 1.8 V | 133 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | 3-STATE | SERIAL | 1.8 V | QSPI | 2 V | 1.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PBGA-B24 | 85 °C | -40 °C | 24 | PLASTIC/EPOXY | TBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | BALL | 1 mm | BOTTOM | 1.2 mm | 8 mm | 6 mm | SPANSION INC | FBGA-24 | unknown | EAR99 | 8542.32.00.51 | ||||||||||||
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S25FL128SAGBHID11
Spansion
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Check for Price | Transferred | 134.2177 Mbit | 8 | 16MX8 | 3 V | 133 MHz | FLASH | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | SERIAL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | R-PBGA-B24 | 85 °C | -40 °C | 24 | PLASTIC/EPOXY | TBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | BALL | 1 mm | BOTTOM | 1.2 mm | 8 mm | 6 mm | SPANSION INC | TBGA, | unknown | EAR99 | 8542.32.00.51 | ||||||||||||||||
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S25FL256SDSMFI000
Spansion
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Check for Price | Transferred | 268.4355 Mbit | 8 | 32MX8 | 3 V | 133 MHz | FLASH | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | SERIAL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | R-PDSO-G16 | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 2.65 mm | 10.3 mm | 7.5 mm | SPANSION INC | SOIC-16 | unknown | 3A991.B.1.A | 8542.32.00.51 | ||||||||||||||||
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S25FS512SAGBHI213
Spansion
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Check for Price | Transferred | 536.8709 Mbit | 8 | 64MX8 | 1.8 V | 133 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | 3-STATE | SERIAL | 1.8 V | QSPI | 2 V | 1.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PBGA-B24 | 85 °C | -40 °C | 24 | PLASTIC/EPOXY | TBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | BALL | 1 mm | BOTTOM | 1.2 mm | 8 mm | 6 mm | SPANSION INC | FBGA-24 | unknown | EAR99 | 8542.32.00.51 | ||||||||||||
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S25FS256SAGBHV203
Spansion
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Check for Price | Transferred | 268.4355 Mbit | 8 | 32MX8 | 1.8 V | 133 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | 3-STATE | SERIAL | 1.8 V | QSPI | 2 V | 1.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PBGA-B24 | 105 °C | -40 °C | 24 | PLASTIC/EPOXY | TBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | BALL | 1 mm | BOTTOM | 1.2 mm | 8 mm | 6 mm | SPANSION INC | BGA-24 | unknown | EAR99 | 8542.32.00.51 | ||||||||||||
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S25FL128SDPBHID11
Spansion
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Check for Price | Transferred | 134.2177 Mbit | 8 | 16MX8 | 3 V | 133 MHz | FLASH | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | SERIAL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | R-PBGA-B24 | 85 °C | -40 °C | 24 | PLASTIC/EPOXY | TBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | BALL | 1 mm | BOTTOM | 1.2 mm | 8 mm | 6 mm | SPANSION INC | TBGA, | unknown | EAR99 | 8542.32.00.51 | ||||||||||||||||
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S25FL256SAGBHI313
Spansion
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Check for Price | Yes | Transferred | 268.4355 Mbit | 8 | 32MX8 | 3 V | 133 MHz | FLASH | ALSO CONFIGURABLE AS 128M X 1 | 2 | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PBGA-B24 | Not Qualified | 85 °C | -40 °C | 24 | PLASTIC/EPOXY | TBGA | BGA24,4X6,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | BALL | 1 mm | BOTTOM | 1.2 mm | 8 mm | 6 mm | SPANSION INC | FBGA-24 | compliant | 3A991.B.1.A | 8542.32.00.51 | BGA | 24 | ||
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S25FL256SDPMFI000
Spansion
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Check for Price | Transferred | 268.4355 Mbit | 8 | 32MX8 | 3 V | 133 MHz | FLASH | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | SERIAL | 3 V | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | R-PDSO-G16 | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 2.65 mm | 10.3 mm | 7.5 mm | SPANSION INC | SOP, | compliant | EAR99 | 8542.32.00.51 | ||||||||||||||||
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S70FL01GSAGMFV010
Spansion
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Check for Price | Yes | Transferred | 1.0737 Gbit | 8 | 128MX8 | 133 MHz | FLASH | 100 | 1000000 Write/Erase Cycles | 128000000 | 134.2177 M | SERIAL | 3 V | SPI | 300 µA | 100 µA | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-G16 | Not Qualified | 105 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | SPANSION INC | compliant | 3A991.B.1.A | 8542.32.00.51 | |||||||||||||||||
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S25FL128SAGBHID10
Spansion
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Check for Price | Yes | Transferred | 134.2177 Mbit | 8 | 16MX8 | 3 V | 133 MHz | FLASH | ALSO CONFIGURABLE AS 128M X 1 | 2 | 20 | 100000 Write/Erase Cycles | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PBGA-B24 | Not Qualified | 85 °C | -40 °C | 24 | PLASTIC/EPOXY | TBGA | BGA24,4X6,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | BALL | 1 mm | BOTTOM | 1.2 mm | 8 mm | 6 mm | SPANSION INC | TBGA, BGA24,4X6,40 | unknown | 3A991.B.1.A | 8542.32.00.51 | BGA | 24 |