Parametric results for: 办个交通银行ATM机转账凭条Q微507067086欢迎 under ATM/SONET/SDH ICs

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ONET8521TY
Texas Instruments
$3.4188 No Active 3.3 V ATM/SONET/SDH SUPPORT CIRCUIT Data rate is 11.3 Gbps SONET 1 40 mA INDUSTRIAL R-XUUC-N18 Not Qualified 100 °C -40 °C NOT SPECIFIED NOT SPECIFIED 18 UNSPECIFIED DIE DIE OR CHIP RECTANGULAR UNCASED CHIP YES NO LEAD UPPER 870 µm 1.036 mm TEXAS INSTRUMENTS INC DIE DIE, DIE OR CHIP 18 compliant 8542.39.00.01
ONET8541TY
Texas Instruments
$3.4188 No Active 3.3 V ATM/SONET/SDH SUPPORT CIRCUIT Data rate is 11.3 Gbps SONET 1 40 mA INDUSTRIAL R-XUUC-N18 Not Qualified 100 °C -40 °C NOT SPECIFIED NOT SPECIFIED 18 UNSPECIFIED DIE DIE OR CHIP RECTANGULAR UNCASED CHIP YES NO LEAD UPPER 870 µm 1.036 mm TEXAS INSTRUMENTS INC DIE DIE-18 18 compliant 8542.39.00.01
SY88993AVKG
Micrel Inc
$3.5300 Yes Transferred 3.3 V BIPOLAR ATM/SONET/SDH SUPPORT CIRCUIT SDH; SONET 1 65 µA INDUSTRIAL S-PDSO-G10 e4 Not Qualified 1 85 °C -40 °C 260 40 10 PLASTIC/EPOXY TSSOP TSSOP10,.19,20 SQUARE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES Nickel/Palladium/Gold (Ni/Pd/Au) GULL WING 500 µm DUAL 3 mm 3 mm 1.1 mm MICREL INC 3 X 3 MM, LEAD FREE, MSOP-10 compliant
ONET8541TYS4
Texas Instruments
$3.6036 No Active 3.3 V ATM/SONET/SDH SUPPORT CIRCUIT Data rate is 11.3 Gbps 1 40 mA INDUSTRIAL R-XUUC-N 100 °C -40 °C 18 UNSPECIFIED DIE RECTANGULAR UNCASED CHIP YES NO LEAD UPPER 870 µm 1.036 mm TEXAS INSTRUMENTS INC DIE, compliant
SY88073LMG
Microchip Technology Inc
$3.7001 Yes Active 3.3 V ATM/SONET/SDH SUPPORT CIRCUIT SONET 1 75 mA INDUSTRIAL S-XQCC-N16 e4 2 85 °C -40 °C 260 40 16 UNSPECIFIED HVQCCN LCC16,.12SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES NICKEL PALLADIUM GOLD NO LEAD 500 µm QUAD 3 mm 3 mm 900 µm MICROCHIP TECHNOLOGY INC HVQCCN, compliant 8542.39.00.01 EAR99 Microchip
SY88083LMG
Microchip Technology Inc
$3.7001 Yes Active 3.3 V ATM/SONET/SDH SUPPORT CIRCUIT SDH; SONET 1 75 mA INDUSTRIAL S-XQCC-N16 e4 2 85 °C -40 °C 260 40 16 UNSPECIFIED HVQCCN LCC16,.12SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES NICKEL PALLADIUM GOLD NO LEAD 500 µm QUAD 3 mm 3 mm 900 µm MICROCHIP TECHNOLOGY INC HVQCCN, compliant 8542.39.00.01 EAR99 Microchip
SY88993ALKG
Microchip Technology Inc
$3.8527 Yes Active 3.3 V ATM/SONET/SDH SUPPORT CIRCUIT SDH; SONET 1 55 mA INDUSTRIAL S-PDSO-G10 e4 Not Qualified 2 85 °C -40 °C 260 40 10 PLASTIC/EPOXY TSSOP TSSOP10,.19,20 SQUARE SMALL OUTLINE YES NICKEL PALLADIUM GOLD GULL WING 500 µm DUAL 3 mm 3 mm 1.1 mm MICROCHIP TECHNOLOGY INC 3 X 3 MM, LEAD FREE, MSOP-10 compliant 8542.39.00.01 EAR99
MAX3969ETP+
Maxim Integrated Products
$3.8786 Yes Yes Transferred 3.3 V BIPOLAR ATM/SONET/SDH SUPPORT CIRCUIT ATM 1 45 µA INDUSTRIAL S-XQCC-N20 e3 Not Qualified 1 85 °C -40 °C 260 30 20 UNSPECIFIED HVQCCN LCC20,.16SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES MATTE TIN NO LEAD 500 µm QUAD 4 mm 4 mm 800 µm MAXIM INTEGRATED PRODUCTS INC QFN HVQCCN, LCC20,.16SQ,20 20 compliant 8542.33.00.01 EAR99
SY88347DLEY
Micrel Inc
$3.9100 Yes Transferred 3.3 V BIPOLAR ATM/SONET/SDH SUPPORT CIRCUIT SDH; SONET 1 60 µA INDUSTRIAL S-PDSO-G10 e3 Not Qualified 3 85 °C -40 °C 260 40 10 PLASTIC/EPOXY HTSSOP TSSOP10,.19,20 SQUARE SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH YES Matte Tin (Sn) GULL WING 500 µm DUAL 3 mm 3 mm 1.1 mm MICREL INC LEAD FREE, EXPOSED PAD, MSOP-10 compliant
SY88149HALMG
Microchip Technology Inc
$3.9422 Yes Active 3.3 V ATM/SONET/SDH SUPPORT CIRCUIT SDH; SONET 1 80 mA INDUSTRIAL S-XQCC-N16 e4 2 85 °C -40 °C 260 40 16 UNSPECIFIED HVQCCN LCC16,.12SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES NICKEL PALLADIUM GOLD NO LEAD 500 µm QUAD 3 mm 3 mm 900 µm MICROCHIP TECHNOLOGY INC 3 X 3 MM, LEAD FREE, QFN-16 compliant 8542.39.00.01 EAR99