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Parametric results for: 日本国际武道大学文凭毕业证怎么买假的{做证V芯kaa2238}办证-wgmv1 under Other Telecom ICs

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AP22811AW5-7
 Diodes Incorporated 		$0.2895 Yes Active 5 V TELECOM CIRCUIT 1 INDUSTRIAL R-PDSO-G5 e3 85 °C -40 °C 260 30 5 PLASTIC/EPOXY LSSOP RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 950 µm DUAL 1.6 mm 3 mm 1.4 mm DIODES INC SOT25, 5 PIN compliant EAR99 8542.39.00.01
AP2280-2WG-7
 Diodes Incorporated 		$0.2937 Yes Yes Active 1.8 V 1 POWER SUPPLY SUPPORT CIRCUIT 1 R-PDSO-G5 3 85 °C -40 °C 260 30 5 PLASTIC/EPOXY LSSOP TSOP5/6,.11,37 RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 950 µm DUAL 1.6 mm 3 mm 1.45 mm DIODES INC SOT-25, 5 PIN compliant EAR99 8542.39.00.01 SOT 5 NO 6 V 1.5 V
AP22804AW5-7
 Diodes Incorporated 		$0.2971 Yes Yes Active 5 V TELECOM CIRCUIT 1 INDUSTRIAL R-PDSO-G5 e3 85 °C -40 °C 260 30 5 PLASTIC/EPOXY LSSOP RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 950 µm DUAL 1.6 mm 3 mm 1.4 mm DIODES INC SOT-25,5 PIN compliant EAR99 8542.39.00.01
AP22814AW5-7
 Diodes Incorporated 		$0.3057 Yes Yes Active 5 V TELECOM CIRCUIT 1 INDUSTRIAL R-PDSO-G5 e3 85 °C -40 °C 260 30 5 PLASTIC/EPOXY LSSOP RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 950 µm DUAL 1.6 mm 3 mm 1.4 mm DIODES INC SOT-25,5 PIN compliant EAR99 8542.39.00.01
AT88SC0808CRF-MVA1
 Microchip Technology Inc 		$0.3126 Yes Not Recommended CMOS SYNCHRONOUS 1 OTHER e4 70 °C -25 °C UNSPECIFIED RECTANGULAR MICROELECTRONIC ASSEMBLY Nickel/Gold (Ni/Au) MICROCHIP TECHNOLOGY INC compliant 5A992.C 8523.52.00.90 8.192 kbit CRYPTO MEMORY 8 1 1.024 k 1000 1KX8
BGS13SN8E6327XTSA1
 Infineon Technologies AG 		$0.3143 Yes Yes Active MOS TELECOM CIRCUIT 1 INDUSTRIAL S-XBCC-B8 e3 1 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 8 UNSPECIFIED BCC SQUARE CHIP CARRIER YES Tin (Sn) BUTT 400 µm BOTTOM 1.1 mm 1.1 mm 400 µm INFINEON TECHNOLOGIES AG BCC, compliant 8542.39.00.01 Infineon
ATR4253C-PVQW-1
 Microchip Technology Inc 		$0.3155 Yes Active 10 V BICMOS TELECOM CIRCUIT 1 INDUSTRIAL S-XQCC-N16 115 °C -40 °C 16 UNSPECIFIED HVQCCN LCC16,.12SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES NO LEAD 500 µm QUAD 3 mm 3 mm 900 µm MICROCHIP TECHNOLOGY INC 3 X 3 MM, VQFN-16 compliant
AP22814BM8-13
 Diodes Incorporated 		$0.3190 Yes Active TELECOM CIRCUIT e3 260 30 MATTE TIN DIODES INC , compliant EAR99 8542.39.00.01
HT2MOA4S20/E/3/RJ
 NXP Semiconductors 		$0.3232 Yes Active HYBRID TELECOM CIRCUIT e4 Not Qualified NOT SPECIFIED NOT SPECIFIED PLASTIC/EPOXY MODULE(UNSPEC) MICROELECTRONIC ASSEMBLY Silver (Ag) NXP SEMICONDUCTORS compliant COB 35 NXP SOT500-2
AP2281-3FMG-7
 Diodes Incorporated 		$0.3257 Yes Yes Active 1.8 V 1 POWER SUPPLY SUPPORT CIRCUIT 1 R-PDSO-N6 1 85 °C -40 °C 260 30 6 PLASTIC/EPOXY HVSON SOLCC6,.07,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES NICKEL PALLADIUM GOLD NO LEAD 500 µm DUAL 1.81 mm 2 mm 605 µm DIODES INC HVSON, compliant EAR99 8542.39.00.01 DFN 6 NO 6 V 1.5 V
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