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Z87L0116ASG
Zilog Inc
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$32.2483 | Yes | Transferred | 3.3 V | CMOS | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | COMMERCIAL | S-PQFP-G144 | Not Qualified | 70 °C | -20 °C | NOT SPECIFIED | NOT SPECIFIED | 144 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 20 mm | 20 mm | 1.6 mm | ZILOG INC | QFP | LFQFP, | 144 | unknown | 8542.39.00.01 | Cordless Telephone Support Circuit | |||||||
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PCD5041H
Philips Semiconductors
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Check for Price | No | Transferred | CMOS | 12 mA | OTHER | R-PQFP-G64 | e0 | Not Qualified | 70 °C | -25 °C | 64 | PLASTIC/EPOXY | QFP | QFP64,.7X.95,40 | RECTANGULAR | FLATPACK | YES | Tin/Lead (Sn/Pb) | GULL WING | 1 mm | QUAD | PHILIPS SEMICONDUCTORS | QFP, QFP64,.7X.95,40 | unknown | 8542.39.00.01 | ||||||||||||||
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RY3GB040
Sharp Corp
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Check for Price | Obsolete | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | 1 | R-XXMA-X | Not Qualified | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | UNSPECIFIED | UNSPECIFIED | SHARP CORP | 42 X 33 MM, 8 MM HEIGHT, COMPACT PACKAGE-14 | unknown | |||||||||||||||||||||||||
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CXG1097EN
Sony Semiconductor
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Check for Price | Yes | Yes | Obsolete | 2.7 V | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | 17 mA | OTHER | R-XDSO-N16 | e6 | Not Qualified | 85 °C | -35 °C | 260 | 10 | 16 | UNSPECIFIED | VSON | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | YES | Tin/Bismuth (Sn/Bi) | NO LEAD | 400 µm | DUAL | 2.5 mm | 3.5 mm | 900 µm | SONY CORP | SON | VSON, | 16 | unknown | 8542.39.00.01 | |||||
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TRM7F-J01H
Mitsumi Electric Co Ltd
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Check for Price | Obsolete | 2.4 V | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | 1 | 52 mA | R-XXMA-X17 | Not Qualified | 17 | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | NO | UNSPECIFIED | UNSPECIFIED | MITSUMI ELECTRIC CO LTD | , | unknown | 8542.39.00.01 | |||||||||||||||||||||
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KS8803B
Samsung Semiconductor
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Check for Price | No | Obsolete | 5 V | CMOS | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | 7 µA | COMMERCIAL EXTENDED | R-PDIP-T16 | e0 | Not Qualified | 75 °C | -30 °C | 16 | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 19.4 mm | 5.08 mm | SAMSUNG SEMICONDUCTOR INC | DIP | DIP, DIP16,.3 | 16 | compliant | 8542.39.00.01 | ||||||
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SC14422DRVJG
Texas Instruments
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Check for Price | Obsolete | 3 V | CMOS | CORDLESS TELEPHONE BASEBAND CIRCUIT | 1 | S-PQFP-G100 | Not Qualified | 100 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 14 mm | 14 mm | 1.6 mm | NATIONAL SEMICONDUCTOR CORP | LFQFP, | unknown | 8542.39.00.01 | ||||||||||||||||
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ML5800DM
RF Micro Devices Inc
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Check for Price | Obsolete | 3.3 V | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | 1 | 90 mA | COMMERCIAL | S-PQCC-N32 | Not Qualified | 60 °C | -10 °C | 32 | PLASTIC/EPOXY | HQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | YES | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 1.05 mm | RF MICRO DEVICES INC | QFJ | HQCCN, | 32 | unknown | 8542.39.00.01 | |||||||||||
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SC14404BXXAG
National Semiconductor Corporation
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Check for Price | Obsolete | CMOS | CORDLESS TELEPHONE BASEBAND CIRCUIT | 1 | S-PQFP-G100 | Not Qualified | 100 | PLASTIC/EPOXY | FQFP | QFP100,.63SQ,20 | SQUARE | FLATPACK, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 14 mm | 14 mm | 1.758 mm | NATIONAL SEMICONDUCTOR CORP | FQFP, QFP100,.63SQ,20 | unknown | 8542.39.00.01 | ||||||||||||||||
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HPMX-5002-STR
Hewlett Packard Co
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Check for Price | Transferred | 3 V | CORDLESS TELEPHONE BASEBAND CIRCUIT | 1 | 27 mA | S-PQFP-G48 | Not Qualified | 48 | PLASTIC/EPOXY | SQUARE | FLATPACK | YES | GULL WING | QUAD | HEWLETT PACKARD CO | QFP | , | 48 | unknown | 8542.39.00.01 |