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Parametric results for: 1893ckilf under Network Interfaces

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Manufacturer Part Number: 1893ckilf
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1893CKILF
 Integrated Device Technology Inc 		$5.9330 Yes Yes Transferred 3.3 V CMOS 1 100 Gbps INTERFACE CIRCUIT 1 160 µA INDUSTRIAL S-PQCC-N56 e3 Not Qualified 3 85 °C -40 °C 260 30 56 PLASTIC/EPOXY HVQCCN LCC56,.31SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES MATTE TIN NO LEAD 500 µm QUAD 8 mm 8 mm 1 mm INTEGRATED DEVICE TECHNOLOGY INC VFQFPN MLF2-56 56 NLG56P3 compliant EAR99 8542.39.00.01
1893CKILF
 Renesas Electronics Corporation 		$9.7006 Yes Yes Active 3.3 V CMOS 1 100 Gbps INTERFACE CIRCUIT 1 160 µA INDUSTRIAL S-PQCC-N56 e3 Not Qualified 3 85 °C -40 °C 260 30 56 PLASTIC/EPOXY HVQCCN LCC56,.31SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES MATTE TIN NO LEAD 500 µm QUAD 8 mm 8 mm 1 mm RENESAS ELECTRONICS CORP VFQFPN MLF2-56 56 NLG56P3 compliant NLR 8542390001 Renesas Electronics
1893CKILFT
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 3.3 V CMOS 1 100 Gbps INTERFACE CIRCUIT 1 160 µA INDUSTRIAL S-PQCC-N56 e3 Not Qualified 3 85 °C -40 °C 260 30 56 PLASTIC/EPOXY HVQCCN LCC56,.31SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES MATTE TIN NO LEAD 500 µm QUAD 8 mm 8 mm 1 mm INTEGRATED DEVICE TECHNOLOGY INC VFQFPN MLF2-56 56 NLG56P3 compliant EAR99 8542.39.00.01
ICS1893CKILFT
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 3.3 V CMOS 1 100 Gbps INTERFACE CIRCUIT 1 160 µA INDUSTRIAL S-PQCC-N56 e3 Not Qualified 3 85 °C -40 °C 260 30 56 PLASTIC/EPOXY HVQCCN LCC56,.31SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES Matte Tin (Sn) - annealed NO LEAD 500 µm QUAD 8 mm 8 mm 1 mm INTEGRATED DEVICE TECHNOLOGY INC DFN HVQCCN, LCC56,.31SQ,20 56 MLF compliant EAR99 8542.39.00.01
1893CKILFT
 Renesas Electronics Corporation 		Check for Price Yes Active 3.3 V CMOS 1 100 Gbps INTERFACE CIRCUIT 1 160 µA INDUSTRIAL S-PQCC-N56 e3 Not Qualified 3 85 °C -40 °C 260 30 56 PLASTIC/EPOXY HVQCCN LCC56,.31SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES MATTE TIN NO LEAD 500 µm QUAD 8 mm 8 mm 1 mm RENESAS ELECTRONICS CORP VFQFPN HVQCCN, LCC56,.31SQ,20 56 NLG56P3 compliant 8542.39.00.01 Renesas Electronics
ICS1893CKILF
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 3.3 V CMOS 1 100 Gbps INTERFACE CIRCUIT 1 160 µA INDUSTRIAL S-PQCC-N56 e3 Not Qualified 3 85 °C -40 °C 260 30 56 PLASTIC/EPOXY HVQCCN LCC56,.31SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES Matte Tin (Sn) - annealed NO LEAD 500 µm QUAD 8 mm 8 mm 1 mm INTEGRATED DEVICE TECHNOLOGY INC DFN HVQCCN, LCC56,.31SQ,20 56 MLF compliant EAR99 8542.39.00.01