Parametric results for: 1n4568a under Zener Diodes
Filter Your Search
1 - 10 of 268 results
|
Select parts from the table below to compare.
Compare
Compare
|
|
1N4568A-1
Microsemi Corporation
|
$5.6271 | No | Transferred | 500 mW | 6.4 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICAL BONDED | 0.06 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/452G | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS, DO-7, 2 PIN | unknown | Microsemi Corporation | |||||||||||||||
|
JANTX1N4568A-1
Cobham Semiconductor Solutions
|
$6.1589 | Transferred | 500 mW | 6.4 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | 0.064 mV/°C | 5 % | Not Qualified | O-XALF-W2 | e0 | MIL-19500/452 | DO-35 | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | AEROFLEX/METELICS INC | HERMETIC SEALED PACKAGE-2 | unknown | DO-35 | 2 | EAR99 | 8541.10.00.50 | ||||||||||||||
|
|
JAN1N4568A-1
Microchip Technology Inc
|
$6.1690 | No | Active | 500 µA | 500 mW | 6.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICAL BONDED | 0.06 mV/°C | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500/452G | DO-35 | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-7, 2 PIN | compliant | EAR99 | 8541.10.00.50 | |||||||||
|
|
1N4568A-1
Microchip Technology Inc
|
$6.4782 | No | Active | 500 µA | 475 mW | 6.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICAL BONDED | 0.06 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/452G | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-7, 2 PIN | compliant | ||||||||||||||
|
|
1N4568A-1/TR
Microchip Technology Inc
|
$6.6190 | Active | 500 µA | 2 µA | 500 mW | 6.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 3 V | 0.06 mV/°C | 1 % | O-LALF-W2 | MIL-STD-750 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | EAR99 | 8541.10.00.50 | |||||||||||||
|
|
JANTX1N4568A-1
Microchip Technology Inc
|
$7.9287 | No | Active | 500 µA | 500 mW | 6.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICAL BONDED | 0.06 mV/°C | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500/452G | DO-35 | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-7, 2 PIN | compliant | EAR99 | 8541.10.00.50 | |||||||||
|
|
1N4568A
Microchip Technology Inc
|
$8.0737 | No | Active | 500 µA | 475 mW | 6.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 0.064 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | ||||||||||||||||
|
JAN1N4568A-1
Microsemi Corporation
|
$8.1696 | No | No | Transferred | 500 mW | 6.4 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICAL BONDED | 0.06 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/452G | DO-35 | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS, DO-7, 2 PIN | unknown | DO-7 | 2 | EAR99 | 8541.10.00.50 | ||||||||
|
|
1N4568AUR-1
Microsemi Corporation
|
$9.0715 | No | No | Transferred | 500 µA | 500 mW | 6.4 V | SILICON | ZENER DIODE | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 200 Ω | 0.064 mV/°C | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 1 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS, LL34, MELF-2 | unknown | EAR99 | 8541.10.00.50 | ||||||||||
|
|
JANTXV1N4568A-1
Microchip Technology Inc
|
$12.3158 | No | Active | 500 µA | 500 mW | 6.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICAL BONDED | 0.06 mV/°C | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500/452G | DO-35 | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-7, 2 PIN | compliant | EAR99 | 8541.10.00.50 |