Parametric results for: 27hhh图片＋【71989ЗЗ30_Q"Q号】706 under EPROMs

All Filters Access Time-Max I/O Type JESD-30 Code JESD-609 Code Length Manufacturer Memory Density Memory IC Type Memory Width Moisture Sensitivity Level Number of Functions Number of Terminals Number of Words Number of Words Code Operating Mode Operating Temperature-Max Operating Temperature-Min Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style Supply Voltage-Nom (Vsup) Access Time-Max (13)

25 ns 7 30 ns 12 35 ns 98 40 ns 66 45 ns 239 50 ns 16 55 ns 385 60 ns 14 70 ns 399 90 ns 268 100 ns 1 120 ns 92 150 ns 1

Min (ns) - Max (ns)

1,606 hits Apply

COMMON 1,419

1,606 hits Apply

R-CDIP-T24 8 R-CDIP-T28 4 R-CQCC-J32 56 R-CQCC-N28 1 R-CQCC-N32 182 R-GDFP-F24 4 R-GDIP-T24 126 R-GDIP-T28 146 R-GDIP-T32 91 R-GDIP-T40 43 R-PDIP-T24 66 R-PDIP-T28 56 R-PDIP-T40 24 R-PDSO-G28 44 R-PQCC-J32 47 R-XDIP-T24 76 R-XDIP-T28 176 R-XDIP-T32 2 R-XDIP-T40 1 R-XQCC-J32 24 R-XQCC-N28 4 R-XQCC-N32 168 R-XXMA-X 5 S-CDIP-T24 1 S-CQCC-J44 13 S-CQCC-N28 73 S-CQCC-N44 43 S-PQCC-J28 53 S-PQCC-J44 24 S-XQCC-J44 3 S-XQCC-N28 39

1,606 hits Apply

e0 1,522 e3 3 e4 4

1,606 hits Apply

11.43 mm 63 11.45 mm 4 11.5062 mm 46 11.8 mm 12 13.97 mm 182 14.1 mm 24 16.55 mm 19 16.5862 mm 24 16.65 mm 13 17.9 mm 27 31.369 mm 16 31.75 mm 16 32 mm 21 32.15 mm 22 34.67 mm 30 36.322 mm 14 36.83 mm 32 37.1475 mm 36 37.25 mm 24 41.91 mm 6 42.1005 mm 58 51.689 mm 24 52.07 mm 24 52.45 mm 19

Min (mm) - Max (mm)

1,606 hits Apply

Manufacturer (19)

AMD 178 Atmel Corporation 506 Catalyst Semiconductor 97 Cypress Semiconductor 106 e2v technologies 3 General Instrument Corp 1 Integrated Silicon Solution Inc 18 International Rectifier 5 Microchip Technology Inc 579 MWS Wire Industries 1 NEC Electronics America Inc 3 NEC Electronics Group 3 Philips Semiconductors 23 QP Semiconductor 2 Renesas Electronics Corporation 3 Rochester Electronics LLC 48 STMicroelectronics 10 Vishay Semiconductors 8 YAGEO Corporation 12

1,606 hits Apply

Memory Density (6)

16.384 kbit 128 65.536 kbit 587 131.072 kbit 6 262.144 kbit 603 524.288 kbit 39 1.0486 Mbit 235

Min (bit) - Max (bit)

1,606 hits Apply

EPROM 64 OTP ROM 279 UVPROM 1,203 UVPROM CARD 5

1,606 hits Apply

Memory Width (2)

8 1,447 16 151

Min - Max

1,606 hits Apply

1 18 2 64

1,606 hits Apply

1.0 1,551

1,606 hits Apply

24 281 28 596 32 570 40 68 44 83

1,606 hits Apply

2.048 k 128 4.096 k 48 8.192 k 539 16.384 k 55 32.768 k 554 65.536 k 93 131.072 k 181

Min (words) - Max (words)

1,606 hits Apply

2000.0 128 4000.0 48 8000.0 539 16000.0 55 32000.0 554 64000.0 93 128000.0 181

Min - Max

1,606 hits Apply

ASYNCHRONOUS 1,503 SYNCHRONOUS 48

1,606 hits Apply

70.0 °C 581 85.0 °C 515 125.0 °C 502

Min (°C) - Max (°C)

1,606 hits Apply

-55.0 °C 457 -40.0 °C 560 0.0 °C 581

Min (°C) - Max (°C)

1,606 hits Apply

Organization (9)

128KX8 181 16KX16 49 16KX8 6 2KX8 128 32KX8 554 4KX16 48 64KX16 54 64KX8 39 8KX8 539

1,606 hits Apply

3-STATE 1,511

1,606 hits Apply

CERAMIC 493 CERAMIC, GLASS-SEALED 410 CERAMIC, METAL-SEALED COFIRED 381 PLASTIC/EPOXY 314 UNSPECIFIED 5

1,606 hits Apply

DFP 4 DIP 498 QCCJ 181 QCCN 284 SOP 32 TSOP1 12 WDIP 314 WQCCJ 37 WQCCN 224

1,606 hits Apply

DIP24,.3 116 DIP24,.6 136 DIP28,.3 25 DIP28,.6 300 DIP32,.6 74 DIP40,.6 63 LCC28,.35X.55 4 LCC28,.45SQ 107 LCC32,.45X.55 329 LCC44,.65SQ 38 LDCC28,.5SQ 51 LDCC32,.5X.6 101 LDCC44,.7SQ 40 SOP28,.4 23 TSSOP28,.53,22 12

1,606 hits Apply

RECTANGULAR 1,354 SQUARE 249

1,606 hits Apply

CHIP CARRIER 469 CHIP CARRIER, WINDOW 261 FLATPACK 4 IN-LINE 506 IN-LINE, WINDOW 314 MICROELECTRONIC ASSEMBLY 5 SMALL OUTLINE 32 SMALL OUTLINE, THIN PROFILE 12

1,606 hits Apply

Supply Voltage-Nom (Vsup) (1)

5 V 1,598

1,606 hits Apply