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Manufacturer Part Number: 71v35761s183pfg
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71V35761S183PFG8
 Integrated Device Technology Inc 		$3.8083 Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 3.3 ns 183 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.14 V 340 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 3 70 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP 14 X 20 MM, GREEN, PLASTIC, TQFP-100 100 PKG100 compliant 3A991.B.2.A 8542.32.00.41 1997-09-16
71V35761S183PFG
 Integrated Device Technology Inc 		$4.2588 Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 3.3 ns 183 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.14 V 340 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 3 70 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP 14 X 20 MM, GREEN, PLASTIC, TQFP-100 100 PKG100 compliant 3A991.B.2.A 8542.32.00.41 1997-09-16
71V35761S183PFGI8
 Integrated Device Technology Inc 		$5.3156 Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 3.3 ns 183 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 35 mA 3.14 V 350 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e3 3 85 °C -40 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP 14 X 20 MM, GREEN, PLASTIC, TQFP-100 100 PKG100 compliant 3A991.B.2.A 8542.32.00.41 1997-09-16
71V35761S183PFGI
 Integrated Device Technology Inc 		$5.9732 Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 3.3 ns 183 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 35 mA 3.14 V 350 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e3 3 85 °C -40 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC TQFP 14 X 20 MM, PLASTIC, TQFP-100 100 PKG100 compliant 3A991.B.2.A 8542.32.00.41 1997-09-16
71V35761S183PFGI
 Renesas Electronics Corporation 		Check for Price Yes Yes End Of Life 4.7186 Mbit 36 128KX36 3.3 V 3.3 ns 183 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 35 mA 3.14 V 350 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e3 3 85 °C -40 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm RENESAS ELECTRONICS CORP TQFP 100 PKG100 compliant NLR 8542320041 Renesas Electronics
IDT71V35761S183PFG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 3.3 ns CACHE SRAM PIPELINED ARCHITECTURE 1 128000 131.072 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 3 70 °C NOT SPECIFIED NOT SPECIFIED 100 PLASTIC/EPOXY LQFP RECTANGULAR FLATPACK, LOW PROFILE YES Matte Tin (Sn) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LQFP, 100 compliant 3A991.B.2.A 8542.32.00.41
71V35761S183PFGI8
 Renesas Electronics Corporation 		Check for Price Yes Yes End Of Life 4.7186 Mbit 36 128KX36 3.3 V 3.3 ns 183 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 35 mA 3.14 V 350 µA 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e3 3 85 °C -40 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm RENESAS ELECTRONICS CORP TQFP 100 PKG100 compliant NLR 8542320041 Renesas Electronics
IDT71V35761S183PFGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 3.3 ns CACHE SRAM PIPELINED ARCHITECTURE 1 128000 131.072 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS INDUSTRIAL R-PQFP-G100 Not Qualified e3 3 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 100 PLASTIC/EPOXY LQFP RECTANGULAR FLATPACK, LOW PROFILE YES Matte Tin (Sn) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LQFP, 100 compliant 3A991.B.2.A 8542.32.00.41 1999-12-31
IDT71V35761S183PFG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 4.7186 Mbit 36 128KX36 3.3 V 3.3 ns CACHE SRAM PIPELINED ARCHITECTURE 1 128000 131.072 k SYNCHRONOUS PARALLEL 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 3 70 °C NOT SPECIFIED NOT SPECIFIED 100 PLASTIC/EPOXY LQFP RECTANGULAR FLATPACK, LOW PROFILE YES Matte Tin (Sn) GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LQFP, 100 compliant 3A991.B.2.A 8542.32.00.41
71V35761S183PFG8
 Renesas Electronics Corporation 		Check for Price Yes Yes End Of Life 4.7186 Mbit 36 128KX36 3.3 V 3.3 ns 183 MHz CACHE SRAM PIPELINED ARCHITECTURE COMMON 1 128000 131.072 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.14 V 340 µA 3.465 V 3.135 V CMOS COMMERCIAL R-PQFP-G100 Not Qualified e3 3 70 °C 260 30 100 PLASTIC/EPOXY LQFP QFP100,.63X.87 RECTANGULAR FLATPACK, LOW PROFILE YES MATTE TIN GULL WING 650 µm QUAD 1.6 mm 20 mm 14 mm RENESAS ELECTRONICS CORP TQFP 100 PKG100 compliant NLR 8542320041 Renesas Electronics
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