Parametric results for: 950-T-FL-DS/06-CN PROTO under FF/Latches
Filter Your Search
1 - 10 of 43 results
|
Select parts from the table below to compare.
Compare
Compare
|
|
HMC679LC3CTR
Analog Devices Inc
|
$126.1923 | No | Yes | Obsolete | 1 | 1 | YES | HQCCN | 26 GHz | POSITIVE EDGE | 679 | T FLIP-FLOP | BICMOS | COMPLEMENTARY | INDUSTRIAL | S-CQCC-N16 | Not Qualified | e4 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 16 | CERAMIC, METAL-SEALED COFIRED | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | TR | Gold (Au) - with Nickel (Ni) barrier | NO LEAD | 500 µm | QUAD | 1.31 mm | 3 mm | 3 mm | ANALOG DEVICES INC | 3 X 3 MM, ROHS COMPLIANT, CERAMIC, SMT-16 | 16 | E-16-1 | unknown | EAR99 | 8542.39.00.01 | ||||||||
|
|
HMC729LC3CTR
Analog Devices Inc
|
$126.1923 | No | Yes | Active | 1 | 1 | YES | HQCCN | 26 GHz | POSITIVE EDGE | 729 | T FLIP-FLOP | BICMOS | COMPLEMENTARY | INDUSTRIAL | S-CQCC-N16 | Not Qualified | e4 | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 16 | CERAMIC, METAL-SEALED COFIRED | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | TR | Gold (Au) - with Nickel (Ni) barrier | NO LEAD | 500 µm | QUAD | 1.31 mm | 3 mm | 3 mm | ANALOG DEVICES INC | 3 X 3 MM, ROHS COMPLIANT, CERAMIC, SMT-16 | 16 | E-16-1 | compliant | EAR99 | 8542.39.00.01 | |||||||
|
|
HMC729LC3C
Analog Devices Inc
|
$131.5835 | No | Yes | Active | 1 | 1 | YES | HQCCN | POSITIVE EDGE | 729 | T FLIP-FLOP | COMPLEMENTARY | INDUSTRIAL | S-CQCC-N16 | Not Qualified | e4 | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 16 | CERAMIC, METAL-SEALED COFIRED | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Gold (Au) - with Nickel (Ni) barrier | NO LEAD | 500 µm | QUAD | 1.31 mm | 3 mm | 3 mm | ANALOG DEVICES INC | 3 X 3 MM, ROHS COMPLIANT, CERAMIC, SMT-16 | 16 | E-16-1 | compliant | EAR99 | 8542.39.00.01 | Analog Devices | ||||||||||
|
|
HMC679LC3C
Analog Devices Inc
|
$142.5680 | No | Yes | Obsolete | 1 | 1 | YES | HQCCN | POSITIVE EDGE | 679 | T FLIP-FLOP | COMPLEMENTARY | INDUSTRIAL | S-CQCC-N16 | Not Qualified | e4 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 16 | CERAMIC, METAL-SEALED COFIRED | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Gold (Au) - with Nickel (Ni) barrier | NO LEAD | 500 µm | QUAD | 1.31 mm | 3 mm | 3 mm | ANALOG DEVICES INC | 3 X 3 MM, ROHS COMPLIANT, CERAMIC, SMT-16 | 16 | E-16-1 | unknown | EAR99 | 8542.39.00.01 | ||||||||||||
|
FMM361HG
FUJITSU Semiconductor Limited
|
Check for Price | Obsolete | 1 | 1 | YES | DFP | MM | T FLIP-FLOP | 6 GHz | R-CDFP-F14 | Not Qualified | 14 | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | FLATPACK | FLAT | 1.27 mm | DUAL | 1.6 mm | 5.6 mm | 10 mm | FUJITSU LTD | DFP, | 14 | unknown | 8542.39.00.01 | FUJITSU | DFP | ||||||||||||||||||||||
|
|
MFC6020
Freescale Semiconductor
|
Check for Price | No | Obsolete | 2 | NO | QIP | POSITIVE EDGE | T FLIP-FLOP | BIPOLAR | COMMERCIAL | R-PQIP-P6 | Not Qualified | e0 | 70 °C | -10 °C | 6 | PLASTIC/EPOXY | QUIP6A,.4/.6,80 | RECTANGULAR | IN-LINE | Tin/Lead (Sn/Pb) | PIN/PEG | 2 mm | QUAD | MOTOROLA SEMICONDUCTOR PRODUCTS | QIP, QUIP6A,.4/.6,80 | unknown | 8542.39.00.01 | ||||||||||||||||||||||
|
|
HMC679LC3CTR
Hittite Microwave Corp
|
Check for Price | Transferred | 1 | 1 | YES | HQCCN | POSITIVE EDGE | 679 | T FLIP-FLOP | COMPLEMENTARY | INDUSTRIAL | S-CQCC-N16 | e4 | 85 °C | -40 °C | 16 | CERAMIC, METAL-SEALED COFIRED | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | GOLD (80) OVER NICKEL (50) | NO LEAD | 500 µm | QUAD | 1.31 mm | 3 mm | 3 mm | HITTITE MICROWAVE CORP | 3 X 3 MM, ROHS COMPLIANT, CERAMIC, SMT-16 | unknown | 8542.39.00.01 | ||||||||||||||||||||
|
HMC729LC3C
Hittite Microwave Corp
|
Check for Price | Yes | Yes | Transferred | 1 | 1 | YES | HQCCN | POSITIVE EDGE | 729 | T FLIP-FLOP | COMPLEMENTARY | INDUSTRIAL | S-CQCC-N16 | Not Qualified | e4 | 85 °C | -40 °C | 16 | CERAMIC, METAL-SEALED COFIRED | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | GOLD OVER NICKEL | NO LEAD | 500 µm | QUAD | 1.31 mm | 3 mm | 3 mm | HITTITE MICROWAVE CORP | 3 X 3 MM, ROHS COMPLIANT, CERAMIC, SMT-16 | 16 | compliant | 3A001.A.11.B | 8542.39.00.01 | QFN | ||||||||||||||
|
|
BA634
ROHM Semiconductor
|
Check for Price | Obsolete | 1 | 1 | NO | SIP | POSITIVE EDGE | 63 | T FLIP-FLOP | BIPOLAR | 20 kHz | 4.3 mA | COMMERCIAL | R-PSIP-T5 | Not Qualified | 60 °C | -10 °C | 5 | PLASTIC/EPOXY | RECTANGULAR | IN-LINE | THROUGH-HOLE | 2.54 mm | SINGLE | 6.3 mm | 2.4 mm | 11.8 mm | ROHM CO LTD | SIP, | 5 | unknown | 8542.39.00.01 | SIP | |||||||||||||||||
|
|
NLB6222
NTT Electronics Technology Corp
|
Check for Price | No | Contact Manufacturer | 790 ps | 2 | 1 | YES | QFF | 2.8 GHz | POSITIVE EDGE | 6222 | T FLIP-FLOP | ECL | COMPLEMENTARY | 155 mA | OTHER | S-XQFP-F24 | Not Qualified | e0 | 85 °C | 24 | CERAMIC | QFL24,.27SQ,30 | SQUARE | FLATPACK | Tin/Lead (Sn/Pb) | FLAT | 750 µm | QUAD | NTT ELECTRONICS TECHNOLOGY CORP | QFF, QFL24,.27SQ,30 | unknown | 8542.39.00.01 |