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AM27LV020B-200LE
AMD
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Check for Price | No | Obsolete | 2.0972 Mbit | 8 | 256KX8 | 3.3 V | 200 ns | UVPROM | COMMON | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 25 µA | 20 µA | 3.6 V | 2.7 V | CMOS | MILITARY | R-CQCC-N32 | Not Qualified | e0 | 125 °C | -55 °C | 32 | CERAMIC, METAL-SEALED COFIRED | WQCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER, WINDOW | YES | Tin/Lead (Sn/Pb) | NO LEAD | 1.27 mm | QUAD | 3.556 mm | 13.97 mm | 11.43 mm | ADVANCED MICRO DEVICES INC | QFJ | WQCCN, LCC32,.45X.55 | 32 | unknown | 3A001.A.2.C | 8542.32.00.61 | ||
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AM27LV020B-200LEB
AMD
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Check for Price | No | Obsolete | 2.0972 Mbit | 8 | 256KX8 | 3.3 V | 200 ns | UVPROM | COMMON | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 25 µA | 20 µA | 3.6 V | 2.7 V | CMOS | MILITARY | R-CQCC-N32 | Not Qualified | e0 | 125 °C | -55 °C | 32 | CERAMIC, METAL-SEALED COFIRED | WQCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER, WINDOW | YES | Tin/Lead (Sn/Pb) | NO LEAD | 1.27 mm | QUAD | 3.556 mm | 13.97 mm | 11.43 mm | ADVANCED MICRO DEVICES INC | QFJ | WQCCN, LCC32,.45X.55 | 32 | unknown | 3A001.A.2.C | 8542.32.00.61 |