Findchips: Parametric Search Results for AM29BDS128HE9


Select Parts		Part Number

		AM29BDS128HE9VFI Spansion
		AM29BDS128HE9VKF Spansion
		AM29BDS128HE9VKI AMD
		AM29BDS128HE9VKI Spansion

			Most Relevant						Technical																						Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Boot Block	Command User Interface	Common Flash Interface	Data Polling	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Yes

Obsolete

134.2177 Mbit

4K,32K

8MX16

1.8 V

50 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

BOTTOM/TOP

YES

16,254

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

40 µA

60 µA

1.95 V

1.65 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B80

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA80,8X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1 mm

11.5 mm

9 mm

SPANSION INC

BGA

VFBGA, BGA80,8X12,32

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

134.2177 Mbit

8MX16

1.8 V

50 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

1.8 V

1.95 V

1.65 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B80

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1 mm

11.5 mm

9 mm

SPANSION INC

BGA

11.50 X 9 MM, 0.80 MM PITCH, FPBGA-80

compliant

EAR99

8542.32.00.51

Check for Price

Transferred

ADVANCED MICRO DEVICES INC

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

134.2177 Mbit

4K,32K

8MX16

1.8 V

50 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

BOTTOM/TOP

YES

16,254

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

40 µA

60 µA

1.95 V

1.65 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B80

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

BGA80,8X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1 mm

11.5 mm

9 mm

SPANSION INC

BGA

VFBGA, BGA80,8X12,32

compliant

EAR99

8542.32.00.51

Compare

AM29BDS128HE9VFI

Spansion

Check for Price

Yes

Obsolete

134.2177 Mbit

4K,32K

8MX16

1.8 V

50 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

BOTTOM/TOP

YES

16,254

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

40 µA

60 µA

1.95 V

1.65 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B80

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA80,8X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1 mm

11.5 mm

9 mm

SPANSION INC

BGA

VFBGA, BGA80,8X12,32

compliant

EAR99

8542.32.00.51

AM29BDS128HE9VKF

Spansion

Check for Price

Yes

Obsolete

134.2177 Mbit

8MX16

1.8 V

50 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

1.8 V

1.95 V

1.65 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B80

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1 mm

11.5 mm

9 mm

SPANSION INC

BGA

11.50 X 9 MM, 0.80 MM PITCH, FPBGA-80

compliant

EAR99

8542.32.00.51

AM29BDS128HE9VKI

AMD

Check for Price

Transferred

ADVANCED MICRO DEVICES INC

unknown

EAR99

8542.32.00.51

AM29BDS128HE9VKI

Spansion

Check for Price

Obsolete

134.2177 Mbit

4K,32K

8MX16

1.8 V

50 ns

FLASH

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

BOTTOM/TOP

YES

16,254

8000000

8.3886 M

ASYNCHRONOUS

PARALLEL

1.8 V

YES

40 µA

60 µA

1.95 V

1.65 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B80

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

BGA80,8X12,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1 mm

11.5 mm

9 mm

SPANSION INC

BGA

VFBGA, BGA80,8X12,32

compliant

EAR99

8542.32.00.51

Parametric results for: AM29BDS128HE9 under Flash Memories