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AM29LV640DU90RWHI
AMD
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Check for Price | No | Transferred | 67.1089 Mbit | 16 | 32K | 4MX16 | 3.3 V | 90 ns | FLASH | HARDWARE DATA PROTECTION/RESET PIN, 1 MILLION ERASE CYCLES PER SECTOR | YES | YES | YES | 1 | 128 | 4000000 | 4.1943 M | ASYNCHRONOUS | PARALLEL | 3 V | YES | 5 µA | 30 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B63 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 63 | PLASTIC/EPOXY | TFBGA | BGA63,8X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1.2 mm | 12 mm | 11 mm | ADVANCED MICRO DEVICES INC | BGA | 12 X 11 MM, 0.80 MM PITCH, FBGA-63 | 63 | unknown | EAR99 | 8542.32.00.51 | |||||
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AM29LV640DU90RWHI
Spansion
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Check for Price | No | No | Obsolete | 67.1089 Mbit | 16 | 32K | 4MX16 | 3.3 V | 90 ns | FLASH | BOTTOM/TOP | YES | YES | YES | 1 | 128 | 4000000 | 4.1943 M | ASYNCHRONOUS | PARALLEL | 3 V | YES | 5 µA | 30 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B63 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 260 | 63 | PLASTIC/EPOXY | TFBGA | BGA63,8X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1.2 mm | 12 mm | 11 mm | SPANSION INC | BGA | 12 X 11 MM, 0.80 MM PITCH, FBGA-63 | 63 | not_compliant | 3A991.B.1.A | 8542.32.00.51 | |||
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AM29LV640DU90RWHIN
Spansion
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Check for Price | No | Obsolete | 67.1089 Mbit | 16 | 32K | 4MX16 | 3.3 V | 90 ns | FLASH | BOTTOM/TOP | YES | YES | YES | 1 | 128 | 4000000 | 4.1943 M | ASYNCHRONOUS | PARALLEL | 3 V | YES | 5 µA | 30 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B63 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 63 | PLASTIC/EPOXY | TFBGA | BGA63,8X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1.2 mm | 12 mm | 11 mm | SPANSION INC | BGA | 12 X 11 MM, 0.80 MM PITCH, FBGA-63 | 63 | compliant | EAR99 | 8542.32.00.51 | |||||
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AM29LV640DU90RWHIN
AMD
|
Check for Price | No | Transferred | 67.1089 Mbit | 16 | 32K | 4MX16 | 3.3 V | 90 ns | FLASH | YES | YES | YES | 1 | 128 | 4000000 | 4.1943 M | ASYNCHRONOUS | PARALLEL | 3 V | YES | 5 µA | 30 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B63 | Not Qualified | e0 | 85 °C | -40 °C | 63 | PLASTIC/EPOXY | TFBGA | BGA63,8X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Lead (Sn/Pb) | BALL | 800 µm | BOTTOM | 1.2 mm | 12 mm | 11 mm | ADVANCED MICRO DEVICES INC | BGA | 11 X 12 MM, 0.80 MM PITCH, FBGA-63 | 63 | unknown | EAR99 | 8542.32.00.51 |