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CDLL5532B
Microsemi Corporation
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$6.6628 | No | No | Transferred | 1 mA | 500 mW | 12 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | DO-213AA | HERMETIC SEALED, LEADLESS, GLASS, LL34, MELF-2 | 2 | not_compliant | EAR99 | 8541.10.00.50 | ||||||||||
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CDLL5532
Microsemi Corporation
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$6.6628 | No | No | Transferred | 1 mA | 500 mW | 12 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 20 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | DO-213AA | HERMETIC SEALED, LEADLESS, GLASS, LL34, MELF-2 | 2 | unknown | EAR99 | 8541.10.00.50 | ||||||||||
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CDLL5532A
Microsemi Corporation
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$6.6628 | No | No | Transferred | 1 mA | 500 mW | 12 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 10 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | DO-213AA | HERMETIC SEALED, LEADLESS, GLASS, LL34, MELF-2 | 2 | not_compliant | EAR99 | 8541.10.00.50 | ||||||||||
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CDLL5532A
Microchip Technology Inc
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$6.6796 | No | Active | 1 mA | 50 nA | 500 mW | 12 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 9.5 V | 10 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | SOD-80, MELF-2 | compliant | ||||||||||
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CDLL5532B
Microchip Technology Inc
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$6.6796 | No | Active | 1 mA | 50 nA | 500 mW | 12 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 90 Ω | 10.8 V | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | SOD-80, MELF-2 | compliant | |||||||||
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CDLL5532
Microchip Technology Inc
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$6.6796 | No | Active | 1 mA | 50 nA | 500 mW | 12 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 9.5 V | 20 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | SOD-80, MELF-2 | compliant | ||||||||||
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CDLL5532B/TR
Microchip Technology Inc
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$6.8688 | No | Active | 1 mA | 50 nA | 500 mW | 12 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 90 Ω | 10.8 V | 5 % | O-LELF-R2 | DO-213AA | 175 °C | -65 °C | NOT SPECIFIED | NOT SPECIFIED | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant | |||||||||||
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CDLL5532C
Microchip Technology Inc
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$12.5708 | No | Active | 1 mA | 50 nA | 500 mW | 12 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 90 Ω | 10.8 V | 2 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | SOD-80, MELF-2 | compliant | |||||||||
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CDLL5532D
Microchip Technology Inc
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$16.6844 | No | Active | 1 mA | 50 nA | 500 mW | 12 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 90 Ω | 10.8 V | 1 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | SOD-80, MELF-2 | compliant | |||||||||
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CDLL5532D
Compensated Devices Inc
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Check for Price | Transferred | 1 mA | 50 nA | 500 mW | 12 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 1 % | Not Qualified | O-LELF-R2 | e0 | DO-213AA | 125 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | COMPENSATED DEVICES INC | HERMETIC SEALED, GLASS, LL34, MELF-2 | unknown |