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Parametric » Power Circuits » Power Management Circuits

Parametric results for: FPF2027 under Power Management Circuits

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Select Parts		Part Number

		FPF2027 Fairchild Semiconductor Corporation
		FPF2027 onsemi
		FPF2027 Rochester Electronics LLC

				Most Relevant						Technical				Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Supply Voltage-Min (Vsup)	Supply Voltage-Max (Vsup)	Number of Channels	Surface Mount	Adjustable Threshold	Additional Feature	Analog IC - Other Type	Number of Functions	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Manufacturer Package Code	Reach Compliance Code	ECCN Code	HTS Code	Built-in Protections	Interface IC Type	Output Current Flow Direction	Output Peak Current Limit-Nom	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom

Yes

Yes

Transferred

3.3 V

1.6 V

5.5 V

1

YES

NO

LOAD SWITCH

POWER SUPPLY SUPPORT CIRCUIT

1

INDUSTRIAL

R-PBGA-B6

e1

1

85 °C

-40 °C

260

30

6

PLASTIC/EPOXY

VFBGA

BGA6,2X3,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1 mm

1.5 mm

625 µm

FAIRCHILD SEMICONDUCTOR CORP

CSP

CSP-6

6

6 BALL WLCSP, 2X3 ARRAY, 0.5MM PITCH, 300UM BALL

compliant

EAR99

8542.39.00.01

Check for Price

Yes

Obsolete

3.3 V

1.6 V

5.5 V

1

YES

NO

LOAD SWITCH

POWER SUPPLY SUPPORT CIRCUIT

1

INDUSTRIAL

R-PBGA-B6

e1

1

85 °C

-40 °C

6

PLASTIC/EPOXY

VFBGA

BGA6,2X3,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

500 µm

BOTTOM

1 mm

1.5 mm

625 µm

ON SEMICONDUCTOR

CSP-6

compliant

EAR99

8542.39.00.01

Check for Price

Yes

Yes

Active

YES

1

INDUSTRIAL

R-PBGA-B6

e1

COMMERCIAL

1

85 °C

-40 °C

260

30

6

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1 mm

1.5 mm

625 µm

ROCHESTER ELECTRONICS LLC

BGA

1.50 X 1 MM, ROHS COMPLIANT, CSP-6

6

unknown

TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

SOURCE

150 mA

5.5 V

1.6 V

3.3 V

Compare

Fairchild Semiconductor Corporation

Yes

Yes

Transferred

3.3 V

1.6 V

5.5 V

1

YES

NO

LOAD SWITCH

POWER SUPPLY SUPPORT CIRCUIT

1

INDUSTRIAL

R-PBGA-B6

e1

1

85 °C

-40 °C

260

30

6

PLASTIC/EPOXY

VFBGA

BGA6,2X3,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1 mm

1.5 mm

625 µm

FAIRCHILD SEMICONDUCTOR CORP

CSP

CSP-6

6

6 BALL WLCSP, 2X3 ARRAY, 0.5MM PITCH, 300UM BALL

compliant

EAR99

8542.39.00.01

onsemi

Check for Price

Yes

Obsolete

3.3 V

1.6 V

5.5 V

1

YES

NO

LOAD SWITCH

POWER SUPPLY SUPPORT CIRCUIT

1

INDUSTRIAL

R-PBGA-B6

e1

1

85 °C

-40 °C

6

PLASTIC/EPOXY

VFBGA

BGA6,2X3,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

500 µm

BOTTOM

1 mm

1.5 mm

625 µm

ON SEMICONDUCTOR

CSP-6

compliant

EAR99

8542.39.00.01

Drivers And Interfaces

Rochester Electronics LLC

Check for Price

Yes

Yes

Active

YES

1

INDUSTRIAL

R-PBGA-B6

e1

COMMERCIAL

1

85 °C

-40 °C

260

30

6

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1 mm

1.5 mm

625 µm

ROCHESTER ELECTRONICS LLC

BGA

1.50 X 1 MM, ROHS COMPLIANT, CSP-6

6

unknown

TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

SOURCE

150 mA

5.5 V

1.6 V

3.3 V