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FSA3157BL6X
Fairchild Semiconductor Corporation
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Check for Price | Yes | Yes | Transferred | 2.3 V | YES | 30 Ω | 500 mΩ | 13 ns | 7 ns | SPDT | CMOS | 2:1 MULTIPLEXER/DEMULTIPLEXER BUS SWITCH | 1 | 1 | 57 dB | COMMON OUTPUT | 5.5 V | 1.65 V | BREAK-BEFORE-MAKE | INDUSTRIAL | R-PBCC-B6 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | VBCC | SOLCC6,.04,20 | RECTANGULAR | CHIP CARRIER, VERY THIN PROFILE | NICKEL PALLADIUM GOLD | BUTT | 500 µm | BOTTOM | 1.45 mm | 550 µm | 1 mm | FAIRCHILD SEMICONDUCTOR CORP | MICROPAK MLP | 1 MM, LEAD FREE, MICROPAK-6 | 6 | 6LD, MICROPAK, JEDEC MO-252, 1.0MM WIDE - MLP (PREMOLDED) | compliant | EAR99 | 8542.39.00.01 | |||
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FSA3157BL6X-F113
Fairchild Semiconductor Corporation
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Check for Price | Yes | Yes | Obsolete | YES | 50 Ω | CMOS | 1 | COMMON OUTPUT | BREAK-BEFORE-MAKE | INDUSTRIAL | R-PDSO-N6 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 6 | PLASTIC/EPOXY | SON | SOLCC6,.04,20 | RECTANGULAR | SMALL OUTLINE | MATTE TIN | NO LEAD | 500 µm | DUAL | FAIRCHILD SEMICONDUCTOR CORP | SON, SOLCC6,.04,20 | compliant | 8542.39.00.01 | ||||||||||||||||||||||
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FSA3157BL6X
onsemi
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Check for Price | Yes | Obsolete | 2.3 V | YES | 30 Ω | 500 mΩ | 13 ns | 7 ns | SPDT | CMOS | 2:1 MULTIPLEXER/DEMULTIPLEXER BUS SWITCH | 1 | 1 | 57 dB | COMMON OUTPUT | 5.5 V | 1.65 V | BREAK-BEFORE-MAKE | INDUSTRIAL | R-PBCC-B6 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | VBCC | SOLCC6,.04,20 | RECTANGULAR | CHIP CARRIER, VERY THIN PROFILE | NICKEL PALLADIUM | BUTT | 500 µm | BOTTOM | 1.45 mm | 550 µm | 1 mm | ONSEMI | MICROPAK-6 | 127EB | compliant | 8542.39.00.01 | onsemi |