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Parametric results for: HCS1-01 under Telecom Encryption Circuits

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Manufacturer Part Number: hcs101
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HCS101/SN
 Microchip Technology Inc 		$0.8343 Yes Yes Active 5 V DATA ENCRYPTION CIRCUIT 1 2 mA COMMERCIAL R-PDSO-G8 e3 Not Qualified 3 70 °C 260 40 8 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES Matte Tin (Sn) GULL WING 1.27 mm DUAL 3.9116 mm 4.9 mm 1.75 mm MICROCHIP TECHNOLOGY INC SOIC 0.150 INCH, PLASTIC, SOIC-8 8 compliant EAR99 8542.31.00.01 Microchip
HCS101-I/SN
 Microchip Technology Inc 		$0.8897 Yes Yes Active 5 V DATA ENCRYPTION CIRCUIT 1 2 mA INDUSTRIAL R-PDSO-G8 e3 Not Qualified 1 85 °C -40 °C 260 TS 16949 30 8 PLASTIC/EPOXY SOP SOP8,.25 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 3.9 mm 4.9 mm 1.75 mm MICROCHIP TECHNOLOGY INC SOIC SOIC-8 8 compliant EAR99 8542.31.00.01 Microchip
HCS101-I/P
 Microchip Technology Inc 		$1.2460 Yes Yes Active 5 V DATA ENCRYPTION CIRCUIT 1 2 mA INDUSTRIAL R-PDIP-T8 e3 Not Qualified 85 °C -40 °C TS 16949 8 PLASTIC/EPOXY DIP DIP8,.3 RECTANGULAR IN-LINE NO MATTE TIN THROUGH-HOLE 2.54 mm DUAL 7.62 mm 9.271 mm 5.334 mm MICROCHIP TECHNOLOGY INC DIP DIP-8 8 compliant EAR99 8542.31.00.01
HCS101-29GG
 Advanced Interconnections Corp 		Check for Price No Obsolete 2.5 OZ. AVG. INSERTION FORCE e4 260 °C -60 °C 2.54 mm ADVANCED INTERCONNECTIONS CORP compliant EAR99 8536.69.40.40 1.3 inch 0.165 inch 1.3 inch 13X13 AU ON NI Gold (Au) - with Nickel (Ni) barrier BE-CU RND PIN-SKT IC SOCKET PGA101 GLASS FILLED THERMOPLASTIC 0.1 inch STRAIGHT 101 RECTANGULAR 100 µm SOLDER
HCS101-49GT
 Advanced Interconnections Corp 		Check for Price No Obsolete e4 150 °C -60 °C 2.54 mm ADVANCED INTERCONNECTIONS CORP compliant EAR99 8536.69.40.40 1.3 inch 0.12 inch 1.3 inch 13X13 SN-PB ON NI Gold (Au) - with Nickel (Ni) barrier BE-CU RND PIN-SKT IC SOCKET PGA101 GLASS FILLED EPOXY 0.1 inch STRAIGHT 101 RECTANGULAR 100 µm SOLDER
HCS101-49TT
 Advanced Interconnections Corp 		Check for Price No Obsolete 2.5 OZ. AVG. INSERTION FORCE e0 260 °C -60 °C 2.54 mm ADVANCED INTERCONNECTIONS CORP compliant EAR99 8536.69.40.40 1.3 inch 0.095 inch 1.3 inch 13X13 SN-PB ON NI Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier BE-CU RND PIN-SKT IC SOCKET PGA101 GLASS FILLED THERMOPLASTIC 0.1 inch STRAIGHT 101 RECTANGULAR 100 µm SOLDER
HCS101T-/SN
 Microchip Technology Inc 		Check for Price Yes Yes Active 5 V DATA ENCRYPTION CIRCUIT 1 COMMERCIAL R-PDSO-G8 e3 Not Qualified 1 70 °C 260 40 8 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING DUAL MICROCHIP TECHNOLOGY INC SOIC SOP, 8 compliant
HCS101/P
 Microchip Technology Inc 		Check for Price Yes Yes Active 5 V DATA ENCRYPTION CIRCUIT 1 2 mA COMMERCIAL R-PDIP-T8 e3 Not Qualified 70 °C 8 PLASTIC/EPOXY DIP RECTANGULAR IN-LINE NO MATTE TIN THROUGH-HOLE 2.54 mm DUAL 7.62 mm 9.46 mm 4.32 mm MICROCHIP TECHNOLOGY INC DIP 0.300 INCH, PLASTIC, DIP-8 8 compliant EAR99 8542.31.00.01 Microchip
HCS101-01GG
 Advanced Interconnections Corp 		Check for Price No Obsolete 2.5 OZ. AVG. INSERTION FORCE e4 260 °C -60 °C 2.54 mm ADVANCED INTERCONNECTIONS CORP compliant EAR99 8536.69.40.40 1.3 inch 0.165 inch 1.3 inch 13X13 AU ON NI Gold (Au) - with Nickel (Ni) barrier BE-CU RND PIN-SKT IC SOCKET PGA101 GLASS FILLED THERMOPLASTIC 0.1 inch STRAIGHT 101 RECTANGULAR 100 µm SOLDER
HCS101-04GT
 Advanced Interconnections Corp 		Check for Price No Obsolete e4 150 °C -60 °C 2.54 mm ADVANCED INTERCONNECTIONS CORP compliant EAR99 8536.69.40.40 1.3 inch 0.12 inch 1.3 inch 13X13 SN-PB ON NI Gold (Au) - with Nickel (Ni) barrier BE-CU RND PIN-SKT IC SOCKET PGA101 GLASS FILLED EPOXY 0.1 inch STRAIGHT 101 RECTANGULAR 100 µm SOLDER
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