Register or Sign In
Parametric » Memory » SRAMs

Parametric results for: IDT70V3389S5BF under SRAMs

Filter Your Search

1 - 8 of 8 results

|
8 hits
8 hits
8 hits
8 hits
8 hits
8 hits
8 hits
8 hits
8 hits
8 hits
8 hits
8 hits
8 hits
8 hits
8 hits
8 hits
8 hits
8 hits
-
8 hits
-
8 hits
8 hits
8 hits
8 hits
8 hits
8 hits
8 hits
8 hits
8 hits
Manufacturer Part Number: idt70v3389s5bf
Select parts from the table below to compare.
 Compare
Compare
IDT70V3389S5BFG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 1.1796 Mbit 18 64KX18 5 ns 100 MHz APPLICATION SPECIFIC SRAM COMMON 2 64000 65.536 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 3.15 V 360 µA CMOS COMMERCIAL S-PBGA-B208 Not Qualified e1 3 70 °C 260 30 208 PLASTIC/EPOXY FBGA BGA208,17X17,32 SQUARE GRID ARRAY, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, FPBGA-208 compliant 3A991.B.2.A 8542.32.00.41
IDT70V3389S5BF8
 Integrated Device Technology Inc 		Check for Price No No Transferred 1.1796 Mbit 18 64KX18 3.3 V 5 ns 100 MHz MULTI-PORT SRAM PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE COMMON 1 2 64000 65.536 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 3.15 V 360 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY TFBGA BGA208,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Lead (Sn63Pb37) BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC TFBGA, BGA208,17X17,32 not_compliant 3A991.B.2.A 8542.32.00.41 BGA 208 1999-01-01
IDT70V3389S5BFG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 1.1796 Mbit 18 64KX18 3.3 V 5 ns 100 MHz MULTI-PORT SRAM PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE COMMON 1 2 64000 65.536 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 3.15 V 360 µA 3.45 V 3.15 V CMOS COMMERCIAL S-CBGA-B208 Not Qualified e1 3 70 °C 260 30 208 CERAMIC, METAL-SEALED COFIRED LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC LFBGA, BGA208,17X17,32 compliant 3A991.B.2.A 8542.32.00.41 BGA 208
IDT70V3389S5BFGI8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 1.1796 Mbit 18 64KX18 3.3 V 5 ns 100 MHz MULTI-PORT SRAM PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE COMMON 1 2 64000 65.536 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 415 µA 3.45 V 3.15 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e1 3 85 °C -40 °C 260 30 208 PLASTIC/EPOXY TFBGA BGA208,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC TFBGA, BGA208,17X17,32 compliant 3A991.B.2.A 8542.32.00.41 BGA 208
IDT70V3389S5BF
 Integrated Device Technology Inc 		Check for Price No No Transferred 1.1796 Mbit 18 64KX18 3.3 V 5 ns 100 MHz MULTI-PORT SRAM PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE COMMON 1 2 64000 65.536 k SYNCHRONOUS 3-STATE PARALLEL 15 mA 3.15 V 360 µA 3.45 V 3.15 V CMOS COMMERCIAL S-PBGA-B208 Not Qualified e0 3 70 °C 225 20 208 PLASTIC/EPOXY TFBGA BGA208,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Lead (Sn63Pb37) BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC TFBGA, BGA208,17X17,32 not_compliant 3A991.B.2.A 8542.32.00.41 BGA 208 1999-01-01
IDT70V3389S5BFI
 Integrated Device Technology Inc 		Check for Price No No Transferred 1.1796 Mbit 18 64KX18 3.3 V 5 ns 100 MHz MULTI-PORT SRAM PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE COMMON 1 2 64000 65.536 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 415 µA 3.45 V 3.15 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e0 3 85 °C -40 °C 225 20 208 PLASTIC/EPOXY TFBGA BGA208,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Lead (Sn63Pb37) BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC TFBGA, BGA208,17X17,32 not_compliant 3A991.B.2.A 8542.32.00.41 BGA 208 1999-01-01
IDT70V3389S5BFGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 1.1796 Mbit 18 64KX18 3.3 V 5 ns 100 MHz MULTI-PORT SRAM PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE COMMON 1 2 64000 65.536 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 415 µA 3.45 V 3.15 V CMOS INDUSTRIAL S-CBGA-B208 Not Qualified e1 3 85 °C -40 °C 260 30 208 CERAMIC, METAL-SEALED COFIRED LFBGA BGA208,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 800 µm BOTTOM 1.7 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC LFBGA, BGA208,17X17,32 compliant 3A991.B.2.A 8542.32.00.41 BGA 208
IDT70V3389S5BFI8
 Integrated Device Technology Inc 		Check for Price No No Transferred 1.1796 Mbit 18 64KX18 3.3 V 5 ns 100 MHz MULTI-PORT SRAM PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE COMMON 1 2 64000 65.536 k SYNCHRONOUS 3-STATE PARALLEL 30 mA 3.15 V 415 µA 3.45 V 3.15 V CMOS INDUSTRIAL S-PBGA-B208 Not Qualified e0 3 85 °C -40 °C 225 20 208 PLASTIC/EPOXY TFBGA BGA208,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Lead (Sn63Pb37) BALL 800 µm BOTTOM 1.2 mm 15 mm 15 mm INTEGRATED DEVICE TECHNOLOGY INC TFBGA, BGA208,17X17,32 not_compliant 3A991.B.2.A 8542.32.00.41 BGA 208 1999-01-01