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Parametric » Power Circuits » Power Management Circuits

Parametric results for: MAX17312X+ under Power Management Circuits

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Select Parts		Part Number

		MAX17312X+ Maxim Integrated Products
		MAX17312X+T Analog Devices Inc
		MAX17312X+ Analog Devices Inc
		MAX17312X+T Maxim Integrated Products

			Most Relevant								Technical		Compliance		Operating Conditions					Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Supply Voltage-Min (Vsup)	Supply Voltage-Max (Vsup)	Supply Current-Max (Isup)	Threshold Voltage-Nom	Number of Channels	Surface Mount	Adjustable Threshold	Analog IC - Other Type	Number of Functions	JESD-30 Code	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Date Of Intro	Part Package Code	Pin Count	Manufacturer Package Code	Samacsys Manufacturer

Transferred

POWER SUPPLY MANAGEMENT CIRCUIT

e2

1

260

30

TIN SILVER COPPER NICKEL

MAXIM INTEGRATED PRODUCTS INC

,

unknown

EAR99

8542.39.00.01

2019-07-18

Check for Price

Yes

Active

3.6 V

2.3 V

4.9 V

50 µA

+2.8V

1

YES

YES

POWER SUPPLY MANAGEMENT CIRCUIT

1

R-PBGA-B15

e2

1

85 °C

-40 °C

260

30

15

UNSPECIFIED

VFBGA

BGA15,3X5,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

500 µm

BOTTOM

1.678 mm

2.448 mm

690 µm

2019-06-20

15-WLCSP-N/A

15

15-WLCSP-N/A

Analog Devices

Check for Price

Yes

Active

3.6 V

2.3 V

4.9 V

50 µA

+2.8V

1

YES

YES

POWER SUPPLY MANAGEMENT CIRCUIT

1

R-PBGA-B15

e2

1

85 °C

-40 °C

260

30

15

UNSPECIFIED

VFBGA

BGA15,3X5,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

500 µm

BOTTOM

1.678 mm

2.448 mm

690 µm

2019-06-20

15-WLCSP-N/A

15

15-WLCSP-N/A

Analog Devices

Check for Price

Transferred

POWER SUPPLY MANAGEMENT CIRCUIT

e2

1

260

30

TIN SILVER COPPER NICKEL

MAXIM INTEGRATED PRODUCTS INC

,

unknown

EAR99

8542.39.00.01

2019-07-18

Compare

Maxim Integrated Products

Transferred

POWER SUPPLY MANAGEMENT CIRCUIT

e2

1

260

30

TIN SILVER COPPER NICKEL

MAXIM INTEGRATED PRODUCTS INC

,

unknown

EAR99

8542.39.00.01

2019-07-18

Analog Devices Inc

Check for Price

Yes

Active

3.6 V

2.3 V

4.9 V

50 µA

+2.8V

1

YES

YES

POWER SUPPLY MANAGEMENT CIRCUIT

1

R-PBGA-B15

e2

1

85 °C

-40 °C

260

30

15

UNSPECIFIED

VFBGA

BGA15,3X5,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

500 µm

BOTTOM

1.678 mm

2.448 mm

690 µm

2019-06-20

15-WLCSP-N/A

15

15-WLCSP-N/A

Analog Devices

Analog Devices Inc

Check for Price

Yes

Active

3.6 V

2.3 V

4.9 V

50 µA

+2.8V

1

YES

YES

POWER SUPPLY MANAGEMENT CIRCUIT

1

R-PBGA-B15

e2

1

85 °C

-40 °C

260

30

15

UNSPECIFIED

VFBGA

BGA15,3X5,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

500 µm

BOTTOM

1.678 mm

2.448 mm

690 µm

2019-06-20

15-WLCSP-N/A

15

15-WLCSP-N/A

Analog Devices

Maxim Integrated Products

Check for Price

Transferred

POWER SUPPLY MANAGEMENT CIRCUIT

e2

1

260

30

TIN SILVER COPPER NICKEL

MAXIM INTEGRATED PRODUCTS INC

,

unknown

EAR99

8542.39.00.01

2019-07-18