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Manufacturer Part Number: max4760
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MAX4760ETX+
 Maxim Integrated Products 		$4.7059 Yes Yes Transferred 3 V YES 3.5 Ω 200 mΩ 140 ns 50 ns DPDT CMOS 2 4 100 dB SEPARATE OUTPUT 5.5 V 1.8 V BREAK-BEFORE-MAKE INDUSTRIAL S-XQCC-N36 Not Qualified e3 1 85 °C -40 °C 260 30 36 UNSPECIFIED HVQCCN LCC36,.25SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE MATTE TIN NO LEAD 500 µm QUAD 6 mm 800 µm 6 mm MAXIM INTEGRATED PRODUCTS INC QFN HVQCCN, LCC36,.25SQ,20 36 compliant EAR99 8542.39.00.01
MAX4760ETX+T
 Maxim Integrated Products 		$5.6384 Yes Yes Transferred 3 V YES 3.5 Ω 200 mΩ 150 ns 60 ns DPDT CMOS 2 4 80 dB SEPARATE OUTPUT 5.5 V 1.8 V BREAK-BEFORE-MAKE INDUSTRIAL S-XQCC-N36 Not Qualified e3 1 85 °C -40 °C 260 30 36 UNSPECIFIED HVQCCN LCC36,.25SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE MATTE TIN NO LEAD 500 µm QUAD 6 mm 800 µm 6 mm MAXIM INTEGRATED PRODUCTS INC QFN HVQCCN, LCC36,.25SQ,20 36 compliant EAR99 8542.39.00.01
MAX4760EWX+T
 Analog Devices Inc 		Check for Price Yes Active 3 V YES 3.5 Ω 200 mΩ 140 ns 50 ns DPDT CMOS 2 4 100 dB SEPARATE OUTPUT 5.5 V 1.8 V BREAK-BEFORE-MAKE INDUSTRIAL S-PBGA-B36 Not Qualified e1 1 85 °C -40 °C 260 30 36 PLASTIC/EPOXY VFBGA BGA36,6X6,20 SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 500 µm BOTTOM 3.06 mm 670 µm 3.06 mm 36-WLCSP-N/A 36 36-WLCSP-N/A 2004-05-27 Analog Devices
MAX4760EBX+TW
 Maxim Integrated Products 		Check for Price Yes Obsolete DPDT NOT SPECIFIED NOT SPECIFIED MAXIM INTEGRATED PRODUCTS INC compliant EAR99 8542.39.00.01
MAX4760EWX+
 Analog Devices Inc 		Check for Price Yes Active YES 4 Ω 140 ns CMOS 4 SEPARATE OUTPUT BREAK-BEFORE-MAKE INDUSTRIAL S-PBGA-B36 Not Qualified e1 1 85 °C -40 °C 260 30 36 PLASTIC/EPOXY FBGA BGA36,6X6,20 SQUARE GRID ARRAY, FINE PITCH Tin/Silver/Copper (Sn/Ag/Cu) BALL 500 µm BOTTOM 36-WLCSP-N/A 36 36-WLCSP-N/A 2004-05-27
MAX4760EWX+
 Maxim Integrated Products 		Check for Price Yes Yes Transferred YES 4 Ω 140 ns CMOS 4 SEPARATE OUTPUT BREAK-BEFORE-MAKE INDUSTRIAL S-PBGA-B36 Not Qualified e1 1 85 °C -40 °C 260 30 36 PLASTIC/EPOXY FBGA BGA36,6X6,20 SQUARE GRID ARRAY, FINE PITCH TIN SILVER COPPER BALL 500 µm BOTTOM MAXIM INTEGRATED PRODUCTS INC FBGA, BGA36,6X6,20 compliant EAR99 8542.39.00.01
MAX4760EBX-T
 Maxim Integrated Products 		Check for Price No No Obsolete 3 V YES 3.5 Ω 200 mΩ 140 ns 50 ns DPDT CMOS 4 4 100 dB SEPARATE OUTPUT 5.5 V 1.8 V BREAK-BEFORE-MAKE INDUSTRIAL S-PBGA-B36 Not Qualified e0 1 85 °C -40 °C 245 36 PLASTIC/EPOXY VFBGA BGA36,6X6,20 SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH TIN LEAD BALL 500 µm BOTTOM 3.06 mm 670 µm 3.06 mm MAXIM INTEGRATED PRODUCTS INC BGA 3 X 3 MM, UCSP-36 36 not_compliant 8542.39.00.01
MAX4760ETX+T
 Analog Devices Inc 		Check for Price Yes Active 3 V YES 3.5 Ω 200 mΩ 150 ns 60 ns DPDT CMOS 2 4 80 dB SEPARATE OUTPUT 5.5 V 1.8 V BREAK-BEFORE-MAKE INDUSTRIAL S-XQCC-N36 Not Qualified e3 1 85 °C -40 °C 260 30 36 UNSPECIFIED HVQCCN LCC36,.25SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Matte Tin (Sn) NO LEAD 500 µm QUAD 6 mm 800 µm 6 mm 36-LFCSP-6X6X0.75 36 36-LFCSP-6X6X0.75 2004-05-27 Analog Devices
MAX4760ETX-T
 Maxim Integrated Products 		Check for Price No No Obsolete 3 V YES 3.5 Ω 200 mΩ 140 ns 50 ns DPDT CMOS 2 4 100 dB SEPARATE OUTPUT 5.5 V 1.8 V BREAK-BEFORE-MAKE INDUSTRIAL S-XQCC-N36 Not Qualified e0 85 °C -40 °C 36 UNSPECIFIED HVQCCN LCC36,.25SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE TIN LEAD NO LEAD 500 µm QUAD 6 mm 800 µm 6 mm MAXIM INTEGRATED PRODUCTS INC QFN 6 X 6 MM, 0.80 MM HEIGHT, MO-220WJJD-1, TQFN-36 36 not_compliant EAR99 8542.39.00.01
MAX4760ETX+
 Analog Devices Inc 		Check for Price Yes Active 3 V YES 3.5 Ω 200 mΩ 140 ns 50 ns DPDT CMOS 2 4 100 dB SEPARATE OUTPUT 5.5 V 1.8 V BREAK-BEFORE-MAKE INDUSTRIAL S-XQCC-N36 Not Qualified e3 1 85 °C -40 °C 260 30 36 UNSPECIFIED HVQCCN LCC36,.25SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Matte Tin (Sn) - annealed NO LEAD 500 µm QUAD 6 mm 800 µm 6 mm 36-LFCSP-6X6X0.75 36 36-LFCSP-6X6X0.75 2004-05-27 Analog Devices
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